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LT300Pro

Automatic Laser Transfer System

Features

  • High precision transfer placement
    • XY placement: ± 3.5 µm @ 3σ
  • Mass transfer technology
    • > 5 million UPH
  • Flexible laser transfer
    • Easy conversion for any die sizes & pixel pitches
    • Support various laser transfer processes
      • Blind mode
      • Selective mode
      • Refill mode
  • Maximizing mass transfer yield
    • Pre-scan wafer before transfer
    • Post-transfer inspection & re-fill process
  • Non-toxic laser process

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