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Press Releases

ASMPT Semiconductor Solutions at Electronica 2022
05.12.2022 | Press Release

ASMPT Semiconductor Solutions at Electronica 2022

At this year’s Electronica trade fair in Munich, ASMPT exhibited for the first time under its consolidated brand in Europe as the company’s Semiconductor Solutions (SEMI) unit, once again demonstrated its market-leading position in the area of mainstream and advanced equipment for semiconductor assembly and packaging with great success.

ASMPT Group CEO Robin Ng opens industry first joint customer advocacy center for Semiconductor and Electronics Manufacturing in Vietnam
09.11.2022 | Press Release

Enabling the digital world

ASMPT Group CEO Robin Ng opens industry first joint customer advocacy center for Semiconductor and Electronics Manufacturing in Vietnam

Events

OFC 2024
26 - 28 Mar 2024 | Americas

OFC 2024

San Diego, CA, USA

ECOC 2024
23 - 25 Sep 2024 | Europe

ECOC 2024

Frankfurt, Germany

SEMICON Taiwan 2024
4 - 6 Sep 2026 | Asia

SEMICON Taiwan 2024

Taipei, Taiwan

ECTC 2024
28 - 31 May 2024 | Americas

ECTC 2024

Denver, CO, USA

SEMICON China 2024
20 - 22 Mar 2024 | China

SEMICON China 2024

Shanghai, China

Touch Taiwan 2024
24 - 26 Apr 2024 | Asia

Touch Taiwan 2024

Taipei, Taiwan

ISES USA 2024
2 - 3 Apr 2024 | Americas

ISES USA 2024

Arizona, USA

ISES Japan 2024
5 - 6 Mar 2024 | Asia

ISES Japan 2024

Tokyo, USA

iMAPS | Device Packaging
18 - 21 Mar 2024 | Americas

iMAPS 2024

Fountain Hills, AZ, USA

electronica 2024
12 - 15 Nov 2024 | Europe

electronica 2024

Munich, Germany

ISES Taiwan 2024
14 - 15 May 2024 | Asia

ISES Taiwan 2024

Taipei, Taiwan

Market Insights

Embracing the “Year of Micro LED Mass Production”, ASMPT Unveils New Laser Mass Transfer Equipment
24.05.2023 |

Embracing the “Year of Micro LED Mass Production”, ASMPT Unveils New Laser Mass Transfer Equipment

Touch Taiwan 2023 set the tone for the year with its "Micro LED : The Year of Mass Production" exhibition. ASMPT already has mature mass transfer bonding machines, and it has introduced a highly flexible laser transfer machine to fit customers’ mass production plans for this year and next.

Pressure clip sintering for high-power electronics
01.05.2022 |

Pressure clip sintering for high-power electronics

As BEV and/or PHEV products continue to grow in demand, one thing that remains constant is their requirement for highpower electronics (HPE). This class of HPE package will then require pressure sintering, a method whereby the semiconductor chip is attached to a substrate using a silver or copper paste as the main elemental component.

Encapsulating the Future of High-Powered Electronics
21.10.2021 |

Encapsulating the Future of High-Powered Electronics

The current wave of vehicle electrification necessitates car manufacturers using a much amount of semiconductor technology for their solutions, specifically for high-powered packages. This articles shows how important encapsulation technology is essential towards shaping the future of electric vehicles.

Is Encapsulation Ancient for Package Protection?
23.09.2021 |

Is Encapsulation an ‘Ancient’ Technology for Package Protection?

Our internal panel of experts explore how encapsulation technology and how it manages to still keep up with the demanding pace manufacturing advancements.

AIoT Drives Automotive Camera Production to Excellence
21.09.2021 |

AIoT Drives Automotive Camera Production to Excellence

The core of the AIoT solution is powered by the Group’s SkyEye software engine, which uses advanced machine learning algorithms to process manufacturing data. This platform enables customers to start their AIoT journey via several progressive entry points.

ASM Pacific Technology leads the upsurge and breakthrough of camera sensors
08.06.2021 |

ASM Pacific Technology leads the upsurge and breakthrough of camera sensors

A part of our life takes place in a virtual environment and the world is greatly transformed by things like digital workplace, virtual learning, mobile web, cloud computing, and Internet of Things (IoT), indicating how smart life has truly become the new normal.

High Performance Computer System Booming AI and Cloud Computing – ASMPT Plays an Important Role
31.03.2021 |

High Performance Computer System Booming AI and Cloud Computing – ASMPT Plays an Important Role

Due to the COVID-19, a new normal has emerged, and this new 'Smart Life 2.0' lifestyle has created new forms of products and technologies. With that, ASMPT is right behind powering these trends. Read on to find out how ASMPT has continually enabling the digital world.

Realising the Smart Factory Vision through an AI-of-Things (AIoT) Approach
06.01.2021 |

Realising the Smart Factory Vision through an AI-of-Things (AIoT) Approach

In tandem with the Smartphone’s revolution of consumer and business life, a similar wave of change is underway at the factory and production floor, offering the promise of radically transforming the industrial space with a vision of the ‘Smart Factory’ of the future.

ASMPT total power solution to explore the future of new generation WBG power devices
09.09.2020 |

ASMPT total power solution to explore the future of new generation WBG power devices

ASMPT offers total power solution to explore the future of new generation WBG power devices.

ASMPT Well Positioned to Ride The Next Wave of Advanced Packaging in Heterogeneous Integration
26.05.2020 |

ASMPT Well Positioned to Ride The Next Wave of Advanced Packaging in Heterogeneous Integration

ASMPT Well Positioned to Ride The Next Wave of Advanced Packaging in Heterogeneous Integration

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