New Delhi, India, September 10, 2024 – In a significant step towards accelerating readiness for the Tata Electronics semiconductor assembly and test facilities in Vemagal, Karnataka and Jagiroad, Assam, Tata Electronics (a wholly-owned subsidiary of Tata Sons Pvt. Ltd.) signed a Memorandum of Understanding (MOU) with ASMPT to collaborate on establishing semiconductor assembly equipment infrastructure and solutions.
Singapore, August 19, 2024 – ASMPT Limited will exhibit trendsetting semiconductor assembly and packaging equipment at SEMICON India 2024, Greater Noida, September 11 – 13, 2024, IEML, Booth H1V01. The trade fair, coinciding with electronica and productronica India, is regarded as the most important meeting of the electronics industry in South Asia.
新加坡，2024年8月19日 – 全球領先之半導體及電子產品製造硬件及軟件解決方案供應商 ASMPT Limited 將於9 月 4 日至 6 日參展亞洲首屈一指的半導體年度盛會 —— SEMICON Taiwan 2024 國際半導體展。ASMPT 將於台北南港展覽館(TaiNEX) 1 館展位N0762展示其先進系統 NUCLEUS XLplus、POWER VECTOR及VORTEX II，涵蓋人工智能（AI）、智能汽車和智慧工廠解決方案等三大範疇。
[Singapore, August 09, 2024] – ASMPT Limited (HKEX stock code: 0522), the world’s leading maker of integrated solutions for the manufacture of semiconductors and electronics, was recently honoured with the 2023 Supplier Excellence Award from Texas Instruments (TI) for the second year running. This prestigious recognition underscores ASMPT's unmatched commitment to excellence in supplying products and services that consistently meet TI’s high standards.
Building Trust with Suppliers: Key to High Customer Satisfaction
德國 | 法蘭克福
中國 | 深圳
中國 | 上海
韓國 | 首爾
日本 | 東京
德國 | 慕尼黑
印度 | 大諾伊達
韓國 | 釜山
西班牙 | 巴塞隆納
The Yole Group's recent forecast report reveals that the automotive camera market is expected to reach a value of $8.4 billion by 2029. Image sensors (CIS) and ADAS (Advanced Driver Assistance Systems) cameras are projected to account for 80% of the market share, driven by the growing demand for autonomous driving and high-resolution cameras.
ASMPT MEGA series of fully automatic multi-chip bonding machines feature high-precision bonding technology accurate to ±1.5μm and patented dynamic alignment technology. MEGA series supports various components such as photodiodes PD, vertical cavity surface emitting lasers VCSEL, transimpedance amplifiers TIA, electronic integrated circuits EIC, and chip-on-chip COC. The flexible machine configuration enables handling complex multi-chip packaging requirements in a single machine.
In the semiconductor industry chain, the three key nodes of chip design, wafer manufacturing, packaging and testing constitute the complete process of chip manufacturing.
In the foreseeable future, Co-packaged Optics CPO is expected to be the main driver in communication particularly in Silicon Photonics SiPh market. It shortens the electrical path, resulting in greater energy savings, reduced heat generation and more efficient data transmission speed. Leading semiconductor companies in Taiwan, South Korea and United States are currently developing their own CPO solutions. Furthermore, the latest generation of Nvidia AI chip has been announced in Nvidia GTC 2024, which is designed to process vast amounts of data. It is anticipated that the new generation of photonics data transmission will be necessary to fully realize the potential of this emerging “big data” era.
Image clarity is vital for camera performance in ADAS systems, enabling accurate data for informed decisions and safer autonomous driving.
The EU approved a law that will ban the sale of combustion engine cars in its member states from 2035. To achieve zero CO2 emissions by 2050, new energy vehicles, such as electricity, hydrogen or solar energy, are developed for replacement.
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