Innovative Technology AOR TCB™ helps enable the development of more powerful high-bandwidth memory. by Dr. Ami Eitan, SVP, Chief Scientific Officer, ASMPT
Regensburg (Germany), May 20, 2026 – ASMPT Semiconductor Solutions will present technologies for modern power electronics and semiconductor manufacturing at PCIM Expo 2026, taking place in Nuremberg from June 9 to 11. Under the theme “Empower the Intelligence Revolution,” the company will showcase solutions for silver sintering, laser dicing and grooving, and multi-chip bonding at Booth 339 in Hall 6, with a focus on smart mobility.
Singapore, April 28, 2026 – ASMPT will exhibit at SEMICON Southeast Asia 2026 from May 5 to 7, 2026, at Booth #1164 at the MITEC Exhibition Centre in Kuala Lumpur, Malaysia. Under the theme “Empower the Intelligence Revolution,” ASMPT will showcase how advanced semiconductor packaging, intelligent SMT assembly, and intelligent factory technologies enable next generation applications in Artificial Intelligence, Smart Mobility, and Hyperconnectivity.
Singapore, February 18, 2025 – ASMPT, the global leader in semiconductor and electronics manufacturing solutions, will demonstrate its cutting-edge technologies at SEMICON Korea 2025, February 19-21, at COEX, Seoul (Hall D, Booth D432). Under the theme "Lead the Edge: ASMPT Enabling the AI World," the company will present innovations driving the future of intelligent manufacturing.
We would like to extend our heartfelt gratitude to EE Times Asia for the opportunity to discuss the critical role of the semiconductor industry in driving global economic recovery, particularly in relation to AI and sustainability. Our interviewee, Dr. Gary Widdowson, Chief Technology Officer, provided valuable insights into how the demand for high-performance chips continues to rise, driven by advancements in AI, electric vehicles, and next-generation communication technologies. Read the full interview of ASMPT Ltd below for a more comprehensive understanding of our initiatives and the exciting developments within the semiconductor sector.
We are thrilled to share the latest semiconductor market forecast from the World Semiconductor Trade Statistics organization, which predicts robust growth for 2024 and 2025!
[Singapore, July 31, 2025] – ASMPT has been recognised for excellence in the 2025 TechInsights Global Semiconductor Supplier Survey for the 12th consecutive year. This year, it was ranked third for excellence in customer service among large equipment suppliers.
According to Yole Group's latest report, the HBM (High Bandwidth Memory) market is set to surge, contributing to an astonishing US$200 billion memory market by 2025, fueled by advancements in AI, machine learning, and high-performance computing.
2025 is shaping up to be a breakout year for humanoid robotics—and the implications for the semiconductor and advanced packaging industries are profound.
As the demand for electric vehicles and smartphones continues to rise, maintaining high production quality in camera assembly is essential. The CamSpector PRO is designed to meet these challenges with its advanced 2D and 3D wire bond inspection capabilities.
Singapore, May 8, 2025 – ASMPT, a leading global supplier of hardware and software solutions for the manufacture of semiconductors and electronics, in particular advanced packaging (AP) solutions, will be exhibiting at SEMICON Southeast Asia (SEA) from 20 to 22 May 2025 at the Sands Expo and Convention Centre, Singapore (Booth L1613). ASMPT has consistently focused on innovation and technology leadership, emphasising its position as a trusted partner of the global semiconductor industry - especially in challenging times that require stable partnerships and technologically superior solutions. In line with this commitment, Dr Gary Widdowson, Chief Technology Officer at ASMPT Semiconductor Solutions, will present ‘ASMPT AP Technology for HI’ at the ‘Advanced Packaging & Heterogeneous Integration Summit’ on 21 May 2025.
We're thrilled to unveil the latest features of the AERO PRO XPOWER 2.0 – a cutting-edge leader in semiconductor wire bonding!
Regensburg (Germany), April 15, 2025 – At this year’s PCIM trade event in Nuremberg, ASMPT focuses on power electronics for the vehicle of the future at booth 145 in hall 6. With its comprehensive machine portfolio, the market and technology leader offers innovative solutions for the entire production process of automotive power modules.
Artificial Intelligent is advancing at an unprecedented pace, transforming our everyday experiences. From AI-powered vacuums to healthcare, finance, manufacturing, automotive, and consumer electronics such as AR glasses and SmartHome devices, these innovations are enhancing personalization and convenience like never before.
Why is MEGA Essential to This Innovation?
Automated Optical Inspection is a crucial step in the camera or sensor assembly and packaging process, ensuring that every component meets the highest quality standards. ASMPT SEMI Solutions CamSpector PRO is a groundbreaking 2-in-1 AOI system that not only detects foreign materials FM but also performs wire bond inspections.
At ASMPT SEMI Solutions, we are proud to launch our latest innovation – AERO PRO. Engineered for excellence, AERO PRO XPOWER 2.0 feature sets a new standard in the semiconductor equipment industry.
Billerica (USA), March 21, 2024 – ASMPT, the global market and technology leader for hardware and software solutions in the semiconductor and electronics industries, continues to drive the growth of its semiconductor solutions in strategically important markets. To do this, the company relies on experienced industry experts like Dr. Johann Weinhändler, who assumes the role of Regional Head ASMPT Semiconductor Solutions Europe, and Jean-Marc Peallat, PhD, who will take on the role of Regional Head ASMPT Semiconductor Americas. With these appointments, ASMPT is strengthening its market position, expanding its global presence, and underscoring its commitment to innovation paired with proximity to the customer.
Singapore, 3 March 2025 – ASMPT, the global market and technology leader in semiconductor and electronics manufacturing solutions achieved great success at SEMICON Korea 2025. The company showcased its latest cutting-edge hardware and software innovations, attracting significant attention from industry professionals, partners, and potential customers. By focusing on the “edge” of technology, ASMPT demonstrated how these innovations drive transformative change across industries, enabling the AI World. With the advanced solutions presented, ASMPT has once again underlined its leadership in the industry.
Wire bonding continues to be one of the most important connection technologies in electronics. To accommodate ever smaller more densely packaged components and new wire materials while meeting the need to become ever more efficient, including networking and monitoring every step, new solutions are needed.
【新加坡，2025年2月6日】— 全球協作型機器人領導品牌達明機器人（Techman Robot）與半導體製造技術的創新與市場領導者ASMPT正式簽署合作備忘錄（MOU），攜手推動智慧製造的全球化應用與創新。這次策略合作將整合雙方的技術與專業，共同迎接全球產業數位化轉型帶來的挑戰與機遇。
According to the technology roadmap of optical transceiver from Yole Group's report, the 200G VCSEL become more popular in 2025. As the demand for high-speed optical interconnects surges, driven by advancements in silicon photonics, ASMPT SEMI Solutions is at the forefront with our innovative MEGA series. Our fully automatic multi-chip bonding machines are designed to meet the increasing complexity of optical packaging.
Singapore, January 10, 2025 – ASMPT will present at NEPCON Japan, January 22-24, 2025, at Tokyo Big Sight, Booth E66-28. The debut of a high-precision multi-chip bonder, MEGA, will mark its first appearance, presenting solutions tailored for communication in AI devices.
Singapore, December 12, 2024 – ASMPT Limited, Kaynes Semicon Private Limited and Perceptives Solutions today signed two Memorandum of Understanding (MoUs) aimed at enhancing semiconductor expertise through targeted training and knowledge sharing to strengthen India’s semiconductor ecosystem.
台灣 | 台北
美國 | 亞利桑那州
印度 | 新德里德瓦卡
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