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新聞稿及市場洞察

ASMPT at SEMICON Southeast Asia 2026 - From Advanced Packaging to Intelligent Factories
28.04.2026 | 活動新聞

ASMPT at SEMICON Southeast Asia 2026

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ASMPT exhibits at SEMICON India 2025 - Leading-Edge Packaging for Advanced Technologies
10.03.2026 | 活動新聞

Leading-Edge Packaging for Advanced Technologies

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Lead the Edge: ASMPT Enabling the AI World
03.02.2026 | 活動新聞

ASMPT at SEMICON Korea 2025

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ASMPT SEMI Solutions exhibits at NEPCON Japan
05.01.2026 | 活動新聞

ASMPT SEMI Solutions exhibits at NEPCON Japan

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Future-Forward Semiconductors: Enabling AI Innovation and Sustainability
22.12.2025 | 市場洞察

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Future-Forward Semiconductors: Enabling AI Innovation and Sustainability
03.12.2025 | 市場洞察

Future-Forward Semiconductors: Enabling AI Innovation and Sustainability

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ASMPT exhibits at SEMICON India 2025 - Leading-Edge Packaging for Advanced Technologies
27.10.2025 | 活動新聞

Leading-Edge Packaging for Advanced Technologies

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ASMPT, Kaynes Semicon and Perceptives Solutions Forge Strategic Partnership to Advance Semiconductor Training and Expertise
25.09.2025 | 新聞

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ASMPT exhibits at SEMICON India 2025 - Leading-Edge Packaging for Advanced Technologies
23.09.2025 | 活動新聞

Leading-Edge Packaging for Advanced Technologies

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ASMPT AMICRA is Excited to Present Co-Packaged Optics (CPO) Solutions at the ISES USA 2024 Conference
10.09.2025 | 活動新聞

ASMPT AMICRA is Excited to Present Co-Packaged Optics (CPO) Solutions at the ISES USA 2024 Conference

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Exciting Times Ahead for the Semiconductor Industry!
03.09.2025 | 市場洞察

Exciting Times Ahead for the Semiconductor Industry!

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ASMPT exhibits at SEMICON India 2025 - Leading-Edge Packaging for Advanced Technologies
26.08.2025 | 活動新聞

Leading-Edge Packaging for Advanced Technologies

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ASMPT exhibits at SEMICON India 2025 - Leading-Edge Packaging for Advanced Technologies
12.08.2025 | 活動新聞

Leading-Edge Packaging for Advanced Technologies

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Awarded Commitment to Excellent Customer Service
31.07.2025 | 奬項和榮譽

ASMPT Earns Global Recognition for Outstanding Customer Service in 2025 TechInsights Survey

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The future of memory is here, and it's extraordinary!
02.07.2025 | 市場洞察

The future of memory is here, and it's extraordinary!

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Humanoid Robots: The Next Frontier in AI and Automation
19.06.2025 | 新聞

Humanoid Robots: The Next Frontier in AI and Automation

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Spotlight on 2D + 3D Wire Bond Inspections with CamSpector PRO!
17.06.2025 | 新聞

Spotlight on 2D + 3D Wire Bond Inspections with CamSpector PRO!

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Tackling the Challenges of System-In-Package Solutions with MEGA!
10.06.2025 | 新聞

Tackling the Challenges of System-In-Package Solutions with MEGA!

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Unlocking the Future of Edge AI!
30.05.2025 | 市場洞察

Unlocking the Future of Edge AI!

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Empower the Intelligence Revolution
08.05.2025 | 活動新聞

ASMPT at SEMICON SEA showcases comprehensive advanced packaging expertise

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Introducing the Enhanced AERO PRO XPOWER 2.0!
24.04.2025 | 新聞

Introducing the Enhanced AERO PRO XPOWER 2.0!

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Focus on automotive power electronics
15.04.2025 | 活動新聞

ASMPT Semiconductor Solutions at PCIM

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AI Revolution: Expanding the Horizons of Various Applications
09.04.2025 | 市場洞察

AI Revolution: Expanding the Horizons of Various Applications

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Innovative Solution for Radio Frequency Packaging: MEGA with Silver Sintering Paste!
31.03.2025 | 新聞

Innovative Solution for Radio Frequency Packaging: MEGA with Silver Sintering Paste!

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Introducing the CamSpector PRO: Revolutionizing CMOS Image Sensor Packaging with Advanced FM Inspection
26.03.2025 | 新聞

Introducing the CamSpector PRO: Revolutionizing CMOS Image Sensor Packaging with Advanced FM Inspection

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Introducing XPOWER 2.0: Revolutionizing Wire Bonding in Semiconductor Manufacturing!
25.03.2025 | 新聞

Introducing XPOWER 2.0: Revolutionizing Wire Bonding in Semiconductor Manufacturing!

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21.03.2025 | 新聞

ASMPT Semiconductor Solutions under new management in Europe and Americas with Dr. Johann Weinhändler and Jean-Marc Peallat, PhD

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Lead the Edge: ASMPT Enabling the AI World
04.03.2025 | 活動新聞

Great Success at SEMICON Korea 2025

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Lead the Edge: ASMPT Enabling the AI World
18.02.2025 | 活動新聞

ASMPT at SEMICON Korea 2025

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Introducing Our Latest Innovation: The Next-Gen Wire Bonder!
12.02.2025 | 新聞

Introducing Our Latest Innovation: The Next-Gen Wire Bonder!

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達明機器人與ASMPT簽署合作備忘錄，共同推動創新智慧製造
06.02.2025 | 新聞

達明機器人與 ASMPT 簽署合作備忘錄，共同推動創新智慧製造

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Future-Forward Semiconductors: Enabling AI Innovation and Sustainability
06.02.2025 | 市場洞察

Future-Forward Semiconductors: Enabling AI Innovation and Sustainability

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Accelerating the Future of Optical Interconnects with ASMPT MEGA Series!
27.01.2025 | 市場洞察

Accelerating the Future of Optical Interconnects with ASMPT MEGA Series!

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Exciting Times Ahead for the Semiconductor Industry!
17.01.2025 | 市場洞察

Exciting Times Ahead for the Semiconductor Industry!

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ASMPT Unveiling Packaging Solutions Enabling the AI World
10.01.2025 | 活動新聞

Debuting Multi-chip Bonder MEGA at NEPCON Japan 2025

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ASMPT, Kaynes Semicon and Perceptives Solutions Forge Strategic Partnership to Advance Semiconductor Training and Expertise
17.12.2024 | 新聞

ASMPT, Kaynes Semicon and Perceptives Solutions Forge Strategic Partnership to Advance Semiconductor Training and Expertise

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ASMPT, Kaynes Semicon and Perceptives Solutions Forge Strategic Partnership to Advance Semiconductor Training and Expertise
12.12.2024 | 新聞

ASMPT, Kaynes Semicon and Perceptives Solutions Forge Strategic Partnership to Advance Semiconductor Training and Expertise

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Pioneering Semiconductor Innovation: An Interview with Gary Widdowson, CTO of ASMPT SEMI Solutions
03.12.2024 | 市場洞察

Pioneering Semiconductor Innovation: An Interview with Gary Widdowson, CTO of ASMPT SEMI Solutions

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Scaling LWIR: High Volume Manufacturing of Pedestrian Safety Systems
21.11.2024 | 市場洞察

Scaling LWIR: High Volume Manufacturing of Pedestrian Safety Systems

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Innovative bonding technologies for AI and electromobility
14.10.2024 | 活動新聞

Innovative bonding technologies for AI and electromobility

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