26.08.2026
2026年8月26日，新加坡訊 ─ ASMPT 將於9月2日至4日參加SEMICON Taiwan 2026，於TaiNEX 1館四樓L0716展位展示先進封裝解決方案。以「驅動智慧紀元（Empower the Intelligence Revolution）」為主題，ASMPT將聚焦支援人工智慧（AI）、高效能運算（HPC）、共同封裝光學（CPO）及光子技術應用的先進封裝技術，協助客戶因應新一波AI發展所帶來的效能、功耗及系統整合挑戰。
作為全球重要的半導體產業聚落之一，台灣持續引領先進製程與先進封裝技術發展。ASMPT長期與台灣客戶及產業夥伴緊密合作，協助推動新世代半導體技術導入量產，將創新概念轉化為兼具良率與量產能力的製造方案，以滿足AI時代持續成長的運算需求。
為持續深化在地布局及客戶服務能量，ASMPT任命范雅亮（Johnny Fan）擔任台灣區總經理暨業務主管，進一步強化在地領導團隊，以及對客戶的支援與服務。 范雅亮表示：「台灣在全球半導體產業中扮演關鍵角色，尤其在先進封裝領域持續展現領先優勢。我們的客戶正推動AI、高效能運算及矽光子等領域的技術創新，而關鍵挑戰在於如何將這些創新成果轉化為具備規模化量產能力的解決方案。ASMPT將持續透過先進封裝技術與在地支援能力，協助客戶加速創新落地，並推動技術順利導入量產。」
隨著AI應用持續推動半導體架構升級，先進封裝已成為提升運算效能、能源效率及系統整合能力的關鍵技術。在SEMICON Taiwan 2026現場，ASMPT將展示涵蓋高效能運算、AI加速器、矽光子（Silicon Photonics）及共同封裝光學等應用的解決方案，並介紹熱壓鍵合（TCB）與混合鍵合（Hybrid Bonding）等先進封裝技術。
其中，ASMPT將展示MEGA多晶片鍵合解決方案。MEGA結合±2μm的高精度貼裝能力與±0.1°的對位精度，並整合點膠與印膠功能、多種黏著材料平行處理能力、即時UV固化及膠體3D檢測功能。其獨立運作的取放與鍵合手臂、翻轉取放單元及內建旋轉平台，可靈活支援複雜多晶片與矽光子應用相關製程，滿足先進封裝應用需求。
Johnny Fan, General Manager, Country Head & Head of Sales, ASMPT Semiconductor Solutions Taiwan, driving customer engagement and supporting the advancement of Taiwan's semiconductor ecosystem.
Image credit: ASMPT
ASMPT's MEGA multi-chip bonding solution combines ±2 μm placement accuracy and ±0.1° alignment accuracy with integrated dispensing, UV fixation and inspection capabilities to support advanced packaging, silicon photonics and Co-Packaged Optics (CPO) applications.
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About ASMPT Limited (“ASMPT”)
ASMPT Limited is a leading global supplier of hardware and software solutions for the manufacture of semiconductors and electronics. Headquartered in Singapore, ASMPT’s offerings encompass the semiconductor assembly & packaging, and SMT (surface mount technology) industries, ranging from wafer deposition to the various solutions that organise, assemble and package delicate electronic components into a vast range of end-user devices, which include electronics, mobile communications, computing, automotive, industrial and LED (displays). ASMPT partners with customers very closely, with continuous investment in R&D helping to provide cost-effective, industry-shaping solutions that achieve higher productivity, greater reliability, and enhanced quality. ASMPT is also a founding member of the Semiconductor Climate Consortium.
For more information about ASMPT, visit us at asmpt.com.
About ASMPT Semiconductor Limited (“ASMPT SEMI”)
ASMPT SEMI is the leading supplier in advanced packaging and semiconductor assembly solutions. With a commitment to innovation and customer satisfaction, ASMPT SEMI provides a comprehensive range of products and services that cater to the evolving needs of the microelectronics industry. Their expertise spans across areas such as flip-chip and wafer-level packaging, advanced interconnect technologies, and more. ASMPT SEMI's cutting-edge solutions enable customers to achieve higher performance, increased reliability, and improved cost-efficiency when producing their semiconductor devices. ASMPT SEMI sees itself as a pioneer and driving force of the Intelligence Revolution. With its advanced packaging and assembly technologies, the business segment creates the invisible connections that enable intelligent applications in Artificial Intelligence, Smart Mobility and Hyperconnectivity.
For more information about ASMPT SEMI, visit semi.asmpt.com.
Media contacts:
Global ASMPT Semiconductor Solutions Press Office ASMPT Limited Jessica Ho Semiconductor Solutions E-mail: ul.ho@asmpt.com Website: semi.asmpt.com
Global ASMPT Press Office ASMPT Ltd. Susanne Oswald Rupert-Mayer-Strasse 48 81379 Munich Germany Tel: +49 89 20800-26439 E-Mail: susanne.oswald@asmpt.com Website: asmpt.com
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