The digital world is undergoing a fundamental transformation – driven by systems and machines that autonomously interpret data, learn, and act. Technologies like AI, electric vehicles, data centers, and 5G/6G are reshaping entire industries.
Devices are becoming intelligent, requiring:
This accelerates demand for advanced and more sophisticated semiconductor packaging – faster, smarter, more powerful.
ASMPT SEMI Solutions is at the forefront of this evolution, delivering the technologies that empower this intelligent revolution.
ASMPT – Enabling the digital world
Wafer Singulation Solutions
Camera Module & Assembly & Inspection Solutions
Die Attach & Wire Bonding Solutions
Fan-Out Solutions
Thermo-Compression & Hybrid Bonding Solutions
Optoelectronics & Photonics Assembly Solutions
Sintering & Encapsulation Solutions
ASMPT SEMI’s advanced packaging solutions for Artificial Intelligence and High-Performance Computing (HPC) enable next-generation AI accelerators and memory modules through sub-10μm interconnects, chiplet integration, and high-bandwidth memory stacking. Key offerings include industry-leading thermo-compression and hybrid bonding, high-precision die and wire bonding, and multi-chip System-in-Package (SiP) tools, supporting ultra-dense, reliable, and high-performance 2.5D/3D architectures for AI, edge, and cloud applications.
Thermocompression Bonding Solution
Thermocompression bonding for heterogeneous integration
Hybrid Bonding Solution
D2W hybrid bonding breakthrough for 3D integration
Ultra-Fast Die Bonding Solution
High speed die bonding with intelligent force control
Fine-Pitch Wire Bonding Solution
Quality assured wire bonding solution with X-Power thermosonic bonding technology
Wafer- & Panel-Level Pick-&-Place Solution
Large-scale precision for fan-out packaging
Multi-Beam Dicing Solution
Precision SiC dicing for automotive power modules
Universal Camera Module Assembly Solution
Universal die and lens holder bonding solution for camera modules
Dual-Mode Inspection Solution
2-in-1 AOI for CMOS assembly verification
Modular Laser Dicing Solution
Fully automated Laser Dicing & Grooving Solution
ASMPT Semiconductor Solutions delivers comprehensive smart mobility solutions for automotive electronics, featuring advanced packaging and assembly systems for ADAS, LiDAR, and SiC power modules. Our portfolio includes high-precision die bonders, active alignment, wire bonding, and sintering, enabling robust, high-yield, and reliable production of next-generation automotive sensor and power systems.
Multi-Chip Bonding Solution
Automatic high precision multi-chip die bonder for diverse multi-chip packages
Silver Sintering Solution
Oxidation-free, copper-friendly Sintering Solution for Power Modules
Transfer Molding Solution
High-density encapsulation for automotive packages
Eutectic Die Bonding Solution
Automatic eutectic die bonder with controlled heating
ASMPT Semiconductor Solutions’ hyperconnectivity solutions leverage ultra-high precision die attach, advanced optical packaging, and flexible bonding technologies to enable integration of optical and electronic components for high-speed, low-loss connections in AI accelerators, data centres, and telecommunication networks. Key offerings such as ultra precision die and flip chip bonding, multi-chip module assembly, wire bonding, and laser singulation tools support the assembly of next-generation photonic, RF, and high-speed logic modules, meeting the bandwidth and energy efficiency demands of 5G/6G, AI clusters, and critical applications across multiple industries.
Precision Bonder
Ultra-precision placement for co-packaged optics assembly
Hybrid Bond Master
Ultra-precision hybrid bonding for co-packaged optics
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