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Epoxy Die Bonding

An automatic die bonder, specially designed for small packages, the AD832i delivers a fully automatic high-speed epoxy die bonding capabilities for a series of packages (QFN, SOIC, SOP & more). Features ultra-small dot dispensing capabilities, 6 mils ultra-small die handling capabilities. Along with a patented bond arm design.


Automatic Die Bonding System (8” wafer handling)

Dimensions W x D x H
1,970 x 1,350 x 2,190 mm


  • Ultra small dot dispensing capability
  • Capable of ultra-small dice handling
  • Capable of high-density leadframe handling
  • Patented bond head design
  • Dual dispensing system
  • Graphical SPC data with latest IQC system


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