ASMPT Semiconductor Solutions
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High Precision Die Bonding

Productronica2019 Mega 1280x720px 960x540

MEGA

High Flexibility & High Precision Multi-chip Die Bonder

Productronica2019 Photon Pro 1280x720px 960x540

Photon Pro

Automatic High Precision Die Bonder

Productronica2019 Ad280plus 1280x720px 960x540

AD280Plus

Automatic High Precision Die Bonder

Productronica2019 Ad211plusii 1280x720px 960x540

AD211Plus-II

Heated Collet Eutectic Die Bonder

Productronica2019 Amicra Nova 1280x720px 960x540

AMICRA NOVA Plus

Die Bonder and Flip Chip Bonder

ASMPT AMICRA's highly accurate die bonder / flip chip bonder system (±1.0 µm), with multi-chip capability, a modular machine concept and much more!

Productronica2019 Nano 1280x720px 960x540

AMICRA NANO

Die Bonder and Flip Chip Bonder

ASMPT AMICRA’s ultra-precision die bonder / flip chip bonder which supports ±0.2 µm @ 3σ placement accuracy, offering the highest placement accuracy in its class!

Productronica2019 Amicra Cos 1280x720px 960x540

AMICRA CoS

High-precision Chip-on-Substrate Bonding

ASMPT AMICRA's fully automatic, die bonder / flip chip bonder with exceptionally high precision and placement accuracy (±1.5 µm), a cycle time of <15 sec. as well as a modular machine concept, a flip chip option and much more.

Productronica2019 Afc Plus 1280x720px 960x540

AMICRA AFC Plus

Die Bonder and Flip Chip Bonder

ASMPT AMICRA's fully automatic, die bonder / flip chip bonder with exceptionally high precision and placement accuracy (±1.5 µm), a cycle time of <15 sec. as well as a modular machine concept, a flip chip option and much more.

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