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Epoxy Die Bonding

As the world’s largest supplier of semiconductor equipment, we offer a wide range of die bonding solutions that perfectly support your prototype, small-lot or high-volume production while meeting all your requirements in terms of precision, speed, substrate size and flexibility.

INFINITE

Automatic Die Bonding System (12” wafer handling)

Dimensions W x D x H
2,480 x 1,520 x 2,020 mm

Features

  • Leading throughput
  • Excellent XY placement accuracy
  • High density lead frame handling
  • Equipped with uplook optics (optional) to enhance inspection capability
  • Innovation with iFeatures: iTouch, iSense, iDispense

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