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Flip Chip Bonding

Specially designed for low pin count flip chip packages, AD8312FC provides a high speed automatic flip chip bonding solution for packages such as SOIC, SO, QFN, BGA, LGA and more. In order to handle versatile packages, it is also able to handle direct die bonding process. Augmented with high-speed bonding performance, excellent accuracy complete with inline capabilities, the AD8312FC is a perfect fit for your high volume assembly solution.

AD8312FC

Automatic Flip Chip Bonder

Dimensions W x D x H
2,380 x 1,430 x 1,935 mm

Features

  • 2-in-1 flip chip and direct die attach machine
    • Simple and easy conversion between two processes
  • High speed bonding with patented double decoupled bond head system
  • Supporting all-round inspection algorithms at various locations
  • Excellent placement accuracy
  • High density lead frame handling capability

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