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Silver Sintering

A Sintering innovation for power electronics, SilverSAM™ delivers an oxidation-free copper-friendly environment, while designed with a film-assisted sintering process to protect the device against damage. Capable of handling multiple substrate formats, the SilverSAM™ is also applicable for interconnections and expandable volume in productivity.

SilverSAM™ Series

A Sintering Innovation for Power Electronics

Dimensions W x D x H
4,040 x 1,990 x 2,170 mm

Features

  • Oxidation-free copper-friendly environment
    • Sintering / Handling
  • Multiple substrate format
    • Master card panel (5” x 7”) DBC / AMB
    • Singulated DBC / AMB
    • Wafer level
    • Leadframe power discrete
  • Applicable for interconnections
    • Die attach sinter
    • Die top sinter clip / DTS (DBB) / Flexible circuit
    • Substrate to heat sink sinter
  • Expandable volume in productivity
    • 1 Press → 2 Presses → 3 Presses

Other configuration catering to the market

  • SilverSAM-m

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