ASMPT Semiconductor Solutions
Back
Back
  • Products
  • IC & Discrete
  • Advanced Packaging
  • CMOS Image Sensor In-line Solution
  • LED / Photonics
Back
Back
Back
Back
Back
Back
Back
Back
Back
Back
Back
Back
Back
Back
Back
Back
Back
Back
Back
Back
Back
Back
Back
Back

SilverSAM™ Series

A Sintering innovation for power electronics, SilverSAM™ delivers an oxidation-free copper-friendly environment, while designed with a film-assisted sintering process to protect the device against damage. Capable of handling multiple substrate formats, the SilverSAM™ is also applicable for interconnections and expandable volume in productivity.

Features

  • Oxidation-free copper-friendly environment
    • Sintering / Handling
  • Multiple substrate format
    • Master card panel (5” x 7”) DBC / AMB
    • Singulated DBC / AMB
    • Wafer level
    • Leadframe power discrete
  • Applicable for interconnections
    • Die attach sinter
    • Die top sinter clip / DTS (DBB) / Flexible circuit
    • Substrate to heat sink sinter
  • Expandable volume in productivity
    • 1 Press → 2 Presses → 3 Presses

Brochure

Corporate Information
Products
Solutions
Social Media
© ASMPT 2024 | Legal notice

Choose your preferred language

English | Deutsch | 日本語 | 简体中文 | 繁體中文