ASMPT Semiconductor Solutions
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  • IC & Discrete
  • Advanced Packaging
  • CMOS Image Sensor In-line Solution
  • LED / Photonics
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Laser Dicing & Grooving

ASMPT’s laser-based wafer separation machines are leading in Edge quality with lowest Cost of Ownership based on VI dicing and/or Matrix grooving processes. ASMPT has developed a broad portfolio of options for all models to address the specific challenges of our customer’s markets, both for OSAT and tier1 IDM companies. Our latest released model is G-UV-USP which is used for Grooving applications in the Memory market.

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