ASMPT’s laser-based wafer separation machines are leading in Edge quality with lowest Cost of Ownership based on VI dicing and/or Matrix grooving processes. ASMPT has developed a broad portfolio of options for all models to address the specific challenges of our customer’s markets, both for OSAT and tier1 IDM companies.
UV Grooving & DicingPlus System
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Complete portfolio for wafer level and panel level packaging technologies.