ASMPT’s laser-based wafer separation machines are leading in Edge quality with lowest Cost of Ownership based on VI dicing and/or Matrix grooving processes. ASMPT has developed a broad portfolio of options for all models to address the specific challenges of our customer’s markets, both for OSAT and tier1 IDM companies. Our latest released model is G-UV-USP which is used for Grooving applications in the Memory market.
Multi-beam Laser Dicing of SiC Wafers
Complete portfolio for wafer level and panel level packaging technologies.