Laser Dicing & Grooving

ASMPT’s laser-based wafer separation machines are leading in Edge quality with lowest Cost of Ownership based on VI dicing and/or Matrix grooving processes. ASMPT has developed a broad portfolio of options for all models to address the specific challenges of our customer’s markets, both for OSAT and tier1 IDM companies.

LASER1205

UV Grooving & Dicing^Plus System

Dimensions	W x D x H
	1,500 x 2,000 x 2,200 mm

Features

Ability to dice wafer material as well as DAF or FOW
- Thickness ranging from 10µm to up to 250µm
Large variety of grooving widths
- Ranging from 10µm to 100µm or more due to wide selection of multi beam matrix configurations
Extremely high position and grooving accuracy and repro (< ± 1µm)
Narrow dicing width (< 12µm for 100µm thickness)
Small HAZ (2 .. 3µm for 100µm thickness)
High UPH (typically 50% faster than competition) due to system concept design focused on laser material processing
- Ultra short index time
- Dual cassette stations
- Dual coat and clean stations
- Kerf Check "On-the-Fly"

Enquiry

Laser Dicing & Grooving

LASER1205

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