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Wedge Bonding

HERCULES LM

Heavy Aluminum Wire Bonding System (for Module-based Applications)

Dimensions W x D x H
950 x 1,590 x 2,100 mm

Features

  • High speed with excellent bonding quality
  • 4 – 20mil Al wire handling capability
    • 3mil / 25mil Al wire handling by same bondhead (optional)
  • 10 – 20mil Cu wire handling capability
  • Large effective bonding area: 450 x 310 mm
  • Specific design for power package and modules applications
    • IGBT module
    • DBC panel

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