Wedge Bonding

HERCULES LM

Heavy Aluminum Wire Bonding System (for Module-based Applications)

Features

• High speed with excellent bonding quality
• 4 – 20mil Al wire handling capability
  • 3mil / 25mil Al wire handling by same bondhead (optional)
• 10 – 20mil Cu wire handling capability
• Large effective bonding area: 450 x 310 mm
• Specific design for power package and modules applications
  • IGBT module
  • DBC panel

Enquiry