FOL

Automatic Laser Scribing System

Dimensions	W x D x H
	1,550 mm x 1,975 mm x 2,110 mm

Features

Advanced Semi-Surface Dicing (SSD) capability
- Essential for thin wafer handling
High yield on breakage
- Pre-crack formation
Accurate cut depth, dealing with wafer thickness variation
- > 1,800 Z-level reference points per wafer, without any trade-off on throughput
Precise & straight cutting performanc
Fully utilized laser power, ZERO idle time
- Patented dual-table design
Multi-lane dicing capability (option)

Automatic Map Sorter

Dimensions	W x D x H
	1,420 mm x 1,420 mm x 2,045 mm

Features

Extra Large effective binning area
- With uplook: up to dia. 150 mm
- Without uplook: 125 mm x 125 mm
Latest dual arm bond head system
Widely implementing high speed linear and direct drive rotary motion system
Precise XY placement
- Standard: ± 38 µm
- Optional up-look inspection: ± 10 µm
  - Die size: 0.15 mm x 0.15 mm - 5 mm x 5 mm
Large wafer handling: up to Ø 8” picking area
Up to 200 (25 slots x 8 magazines) output bin frames for large number of bin sorting
- Standard: Max 150 bin grade
Motorized XY ejector for faster set-up time
Fast & accurate 1D & 2D barcode scanning system