ASMPT Semiconductor Solutions
Back
Back
  • Products
  • Advanced Packaging
  • IC & Discrete
  • CMOS Image Sensor In-line Solution
  • LED / Photonics
Back
Back
Back
Back
Back
Back
Back
Back
Back
Back
Back
Back
Back
Back
Back
Back
Back
Back
Back
Back
Back

eClip-ADVANCE

Flexibility and precision in one powerful solution

Specially designed for high power device application, eClip-ADVANCE provides the fully automatic and high speed clip bonding solution - from die attach, clip bonding to solder reflow process. Inheriting the fully success of power device application, eClip-ADVANCE offers the most cost-effective solution on your assembly process with fast and reliable bondhead and 2-in-1 solder paste writing system, it can further enhance your competitiveness and flexibility in the rapid developing market.

Features

  • All-in-one bonding solution from die bonding to clip bonding to reflow process
  • Patented bond head design
  • Support dual dispensing system
  • Capable of array clip bonding
  • Support independent temperature controlled zones for reflow process
  • Optional configurations with
    • 12” wafer handling
    • Flip chip bonding
    • Multi-die bonding

Brochure

Corporate Information
Products
Solutions
Social Media
© ASMPT 2025 | Legal notice

Choose your preferred language

English | Deutsch | 日本語 | 简体中文 | 繁體中文