ASMPT Semiconductor Solutions
Back
Back
  • Products
  • IC & Discrete
  • Advanced Packaging
  • CMOS Image Sensor
  • LED / Photonics
Back
  • Solutions
  • Applications
  • Industries
Back
Back
Back
Back
Back
Back
Back
  • Applications
  • Advanced Packaging
  • IC & Discrete
  • Power
Back
Back
Back
Back
Back
Back
Back
Back
Back

Wedge Bonding

The HERCULES is the new generation automatic heavy aluminum wire bonding system that allows high-speed bonding for wide range of power packages and module applications. Leveraging on ‘iCut’ an ASMPT developed advanced cutting process to ensure utmost wire cutting accuracy.

With 4 – 20mil Al wire handling capability, and a large, effective bonding area of 110 x 130mm and a multi-row substrate handling capabilities. The HERCULES is also widely applicable for power packages and modules applications (TO Series, DPAK matrix, Power Modules).

HERCULES

Heavy Aluminum Wire Bonding System

Dimensions W x D x H
1,890 x 1,600 x 2,100 mm

Features

  • Hybrid wire bonding capability with dual bond heads system
  • Linear motor and DDR system
  • "Smart BQM" system supervising bonding quality
  • Integration of wire pull testing system (option)

Enquiry

Corporate Information
Industries
Applications
Social Media
© ASMPT 2023 | Legal Notice

Wählen Sie Ihre bevorzugte Sprache

Deutsch | Englisch | 简体中文 | 繁體中文

Choose your preferred language

German | English | 简体中文 | 繁體中文