Package Inspection

SkyHawk PRO

Automatic High Precision Die Bonder

Dimensions	W x D x H
	1,500 mm x 1,500 mm x 1,560 mm

Feature

• Modular Machine Design, configure based on needs
  • Standard, dual elevator, and with reject module
• Near 0% Over Reject
  • Closed-loop feedback with vEye
• Inspection coverage
  • 2D die & wire, 3D die, and 3D wire
• Application Based Optics
  • Leaded / Leadless
  • MEMs
  • Clip
  • Power
  • Hi-Pin count
• CEA Algorithm
  • Highlight key inspect area
• Industry 4.0 Ready with ASMPT AloT
  • Data Collection
  • Modelling
  • Data Analytics
  • Deep Analytics
  • Deep Learning Engine

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