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Package Inspection

SkyHawk PRO

Automatic High Precision Die Bonder

Dimensions W x D x H
1,500 mm x 1,500 mm x 1,560 mm

Feature

  • Modular Machine Design, configure based on needs
    • Standard, dual elevator, and with reject module
  • Near 0% Over Reject
    • Closed-loop feedback with vEye
  • Inspection coverage
    • 2D die & wire, 3D die, and 3D wire
  • Application Based Optics
    • Leaded / Leadless
    • MEMs
    • Clip
    • Power
    • Hi-Pin count
  • CEA Algorithm
    • Highlight key inspect area
  • Industry 4.0 Ready with ASMPT AloT
    • Data Collection
    • Modelling
    • Data Analytics
    • Deep Analytics
    • Deep Learning Engine

Enquiry

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