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IC & Discrete
Clip Bonding
Die Bonding
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Encapsulation
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Inspection, Test & Packing
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Advanced Packaging
Deposition Solutions
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CMOS Image Sensor In-line Solution
Inline Solution
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Die Bonding
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Cleaning
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LED / Photonics
FOL
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Advanced Packaging
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IC & Discrete
General IC / Discrete, Logic, Analog
MEMS
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Power
Power Module Packaging
Discrete Power Device Packaging
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Die Bonding
Epoxy Die Bonding
Eutectic Die Bonding
Flip Chip Bonding
Multi-chip Module Bonding
Soft Solder Die Bonding
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Wire Bonding
Ball Bonding
Wedge Bonding
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Cleaning
DI-Water Cleaning
Plasma Cleaning
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Die Bonding
Automatic Die Bonding
High Precision Die Bonding
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Transfer & Bonding
Laser Transfer
Mass Transfer
High Performance LED Die Bonding
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INFINITE
INFINITE
AD8312PLUS
AD832i
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Eagle AERO
Eagle AERO
AERO PRO
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HERCULES
HERCULES
HERCULES LM
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AD800
AD800
AD830Plus
AD838L-Plus
AD838L-G2
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MEGA
MEGA
Photon Pro
AD211Plus-II
AD280Plus
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VORTEX II
VORTEX II
VORTEX XL
Package Inspection
SkyHawk PRO
Near ZERO OR Automated Optical Inspection Machine
Dimensions
W x D x H
1,500 x 1,500 x 1,560 mm
Features
Modular machine design, high machine configuration flexibility
Single elevator (standard), dual elevators (with or without reject module)
Near 0% over reject
Integrated CEA inspection capability
vEye for automated CEA improvement & management
Application based optics
Unique inspection algorithm (CEA)
Industry 4.0 ready with ASMPT AIoT
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