ASMPT Semiconductor Solutions
Back
Back
  • Products
  • Advanced Packaging
  • IC & Discrete
  • CMOS Image Sensor In-line Solution
  • LED / Photonics
Back
Back
Back
Back
Back
Back
Back
Back
Back
Back
Back
Back
Back
Back
Back
Back
Back
Back
Back
Back
Back
Back
Back
Back

AD300Pro

AD300Pro is an automatic die bonding system specifically designed for MicroLED applications and mass bonding. It incorporates automatic material handling and operates within a unique inert environment. With its exceptional precision in bonding placement and outstanding co-planarity control, the AD300Pro ensures consistent and uniform bonding results. Experience unparalleled reliability and efficiency in MicroLED manufacturing with the AD300Pro, the ultimate solution for precise and superior die bonding.

Features

  • Mass transfer & mass bonding technology
  • Bonding over 300,000 Micro LEDs in one pass
  • High precision bonding placement
    • XY placement: ± 2 µm @ 3σ* (± 1µm @ 3σ under room temperature)
    • Die rotation: ± 0.005° @ 3σ*
  • Excellent co-planarity control
  • Micro LED die size handling: 10 µm x 10 µm

Brochure

Related Articles

* All performance is package and material dependent

Corporate Information
Products
Solutions
Social Media
© ASMPT 2024 | Legal notice

Choose your preferred language

English | Deutsch | 日本語 | 简体中文 | 繁體中文