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AD300Pro

Automatic Die Bonding System

Features

  • Mass transfer & mass bonding technology
  • Bonding over 300,000 Micro LEDs in one pass
  • High precision bonding placement
    • XY placement: ± 2 µm @ 3σ (± 1µm @ 3σ under room temperature)
    • Die rotation: ± 0.005° @ 3σ
  • Excellent co-planarity control
  • Micro LED die size handling: 10 µm x 10 µm

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