17.06.2026
Billerica (USA), June 17, 2026 –– ASMPT, a leading global supplier of hardware and software solutions for the semiconductor and electronics manufacturing industries, has received the 2026 Intel EPIC Supplier Award for Excellence in Business Collaboration—one of Intel Corporation’s highest recognitions for suppliers within its global supply chain.
The award was presented at a ceremony held on June 9 at Intel’s The Moore Center. ASMPT is honoured to be among this year’s select group of recipients. The Intel EPIC Supplier Award recognises top-performing suppliers that deliver excellence across key criteria, including quality, collaboration, and execution.
This year’s theme, “Leading in the AI Era Through Foundry Scale and Execution,” reflects the increasing demands placed on the semiconductor industry. The rapid expansion of artificial intelligence and high-performance computing continues to drive the need for advanced packaging capabilities, tighter process control, accelerated technology ramps, and consistent execution across the supply chain.
“Our 2026 Intel EPIC Supplier Award recipients reflect the strength of Intel’s global supply chain and the trust we’ve built together,” said Lip‑Bu Tan, Chief Executive Officer of Intel. “Their partnership, focus on quality, and commitment to continuous improvement help us deliver for our customers every day.”
ASMPT remains focused on collaboration and continues to work closely with customers worldwide, supporting their evolving needs through reliable execution and continuous improvement.
For more details, see Intel’s official announcement of the 2026 Intel EPIC Supplier Award at https://newsroom.intel.com/corporate/intel-announces-2026-epic-supplier-award-recipients
About ASMPT Limited (“ASMPT”)
ASMPT Limited is a leading global supplier of hardware and software solutions for the manufacture of semiconductors and electronics. Headquartered in Singapore, ASMPT’s offerings encompass the semiconductor assembly & packaging, and SMT (surface mount technology) industries, ranging from wafer deposition to the various solutions that organise, assemble and package delicate electronic components into a vast range of end-user devices, which include electronics, mobile communications, computing, automotive, industrial and LED (displays). ASMPT partners with customers very closely, with continuous investment in R&D helping to provide cost-effective, industry-shaping solutions that achieve higher productivity, greater reliability, and enhanced quality. ASMPT is also a founding member of the Semiconductor Climate Consortium.
About ASMPT Semiconductor Solutions (“ASMPT SEMI”)
ASMPT SEMI is the leading supplier in advanced packaging and semiconductor assembly solutions. With a commitment to innovation and customer satisfaction, ASMPT SEMI provides a comprehensive range of products and services that cater to the evolving needs of the microelectronics industry. Their expertise spans across areas such as flip-chip and wafer-level packaging, advanced interconnect technologies, and more. ASMPT SEMI's cutting-edge solutions enable customers to achieve higher performance, increased reliability, and improved cost-efficiency when producing their semiconductor devices.
ASMPT SEMI sees itself as a pioneer and driving force of the Intelligence Revolution. With its advanced packaging and assembly technologies, the business segment creates the invisible connections that enable intelligent applications in Artificial Intelligence, Smart Mobility and Hyperconnectivity.
Media contacts:
Global ASMPT Press Office ASMPT Limited Susanne Oswald Rupert-Mayer-Strasse 48 81379 Munich Germany Phone: +49 89 20800-26439 E-Mail: susanne.oswald@asmpt.com Website: asmpt.com
HighTech communications GmbH Barbara Ostermeier Brunhamstrasse 21 81249 Munich Germany Phone: +49 89 500778-10 E-Mail: b.ostermeier@htcm.de Website: www.htcm.de
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