ASMPT Semiconductor Solutions
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  • CMOS Image Sensor In-line Solution
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CM-OVEN-S

The CM-OVEN-S is a snap cure oven that offers both contact cure and air curing for different applications. It also provides a flexible curing profile and time setting, and for inline or standalone operation – depending on your needs. With up to 7 curing zones.

Equipped with a universal cone roller for lead frame transferring, split N2 delivery system with N2 curtains at input and output sides to prevent lead frame oxidation. Electric flow sensor improves monitoring & control of N2 flow, plus a temperature control system with thermocouples at heater block and N2 stream.

CMOS Image Sensor Smart COB Inline (Complete Chip on Board Assembly)

Features

  • Flexible curing profile and curing time setting
  • Contact cure and Air curing for different applications
  • Flexible for inline or standalone operation
  • Universal cone roller for LF transferring, no conversion
  • Split N2 delivery system, with N2 curtains at oven’s input and output sides to prevent LF oxidation
  • Electronic flow sensor to improve monitoring and control of N2 flow
  • N2 temperature control system with thermocouples at heater block and N2 stream
  • Effective exhaust system for outgassing suction to prevent LF contamination
  • Dynamic temperature profiling system built into oven
  • Post curing inspection platform provided

Brochure

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