Smart COB Inline

ASMPT Smart COB Inline is a comprehensive chip-on-board (COB) inline solution specifically designed for packaging CMOS image sensors. It offers intelligent inline capabilities that are highly suitable for a wide range of applications, including smartphone cameras, AR/VR devices, security cameras, 3D sensing, medical cameras, and automotive cameras.

This advanced inline solution combines exceptional precision and bonding performance, delivering optimal optical results while maintaining cost-effectiveness and maximizing productivity. With a fully modular design, it offers flexibility and scalability to meet diverse production needs. The solution prioritizes cleanliness by integrating HEPA/ULPA filters and cleaning modules, ensuring a highly clean bonding environment that meets the highest standards.

ASMPT takes immense pride in being one of the pioneering companies that offer comprehensive, one-stop manufacturing solutions for CMOS image sensor packaging. By incorporating Smart Factory and Industry 4.0 technologies, ASMPT has propelled CIS manufacturing to new heights. With a remarkable market presence and widespread customer recognition, ASMPT stands at the forefront of the CMOS image sensor packaging industry.
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