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AD280Plus

Automatic High Precision Die Bonder

Funktionen

  • Achieving ± 3 µm @ 3σ XY placement with patented look-through pattern recognition
  • Flip chip handling capability
  • Diverse material handling
    • Standard: Wafer on expander or clamp ring
    • Optional: Waffle pack, Gel-Pak, tray, tape feeder or by request
  • Enhancing traceability by barcode, 2D code or OCR on substrate / wafer / die (Option)

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