ASMPT Semiconductor Solutions
Back
Back
  • Produkte
  • IC & Discrete
  • Advanced Packaging
  • CMOS Image Sensor
  • LED / Photonics
Back
Back
Back
Back
Back
Back
Back
Back
Back
Back
Back
Back
Back
Back
Back
Back
Back
Back
Back
Back
Back
Back
Back
Back

Photon Pro

Automatic High Precision Die Bonder

Funktionen

  • Patented look-through pattern recognition technology
  • High precision bonding
    • XY placement: ± 3 µm @ 3σ
    • Die rotation: ± 0.1° @ 3σ
  • Large substrate handling, max 200 mm x 215 mm substrate size
  • Enhance material traceability by using OCR
  • Multi-chip bonding capability
    • Auto bond-tool change, up to 10 bond-tool buffers
    • Auto wafer change, up to 6 x 6” OD Foton Ring with 2-stage ejector system
    • High flexibility options to fulfill the requirements of diverse multi-chip packages

Broschüre

Corporate Information
Products
Solutions
Social Media
© ASMPT 2024 | Impressum

Choose your preferred language

English | Deutsch | 日本語 | 简体中文 | 繁體中文