ASMPT Semiconductor Solutions
Back
  • Advanced Packaging
  • IC & Discrete
  • CMOS Image Sensor In-line Solution
  • LED / Photonics
Back
Back
Back

Solutions for MEMS

Micro-Electro-Mechanical Systems (MEMs) and sensors are key enablers in the new era of IoT, Artificial Intelligence, robotics, and smart technology. There is sustainable growth in this market and many new and interesting applications. The package design, assembly flow and process requirements are highly customized. With a full vertical assembly equipment portfolio, ASMPT is in the best position to provide customer turnkey solution, meeting today’s time-to-market business model.

Choose your preferred language

English | Deutsch | 日本語 | 简体中文 | 繁體中文