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AD832U

Integrating with ultra high speed and excellent accuracy, AD832U is an automatic eutectic die bonder for a large range of horizontal small discrete packages, such as SOD323, SOD923 and SOT113 etc. Together with 300 x 100 mm² handling capability, this high speed eutectic die bonder should be your first choice for maximum 8” wafer size eutectic die bonding system in present and next generation.

Features

  • Leading throughput
  • Enhanced manufacturing area efficiency
  • Capable of high density lead frame handling
  • Optional to equip with various modules to achieve
    • Multi-angle bonding
    • Flux eutectic / epoxy bonding

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