ASMPT AMICRA - Revolutionising Optoelectronics with High-Precision Bonding

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ECOC show has just been successfully carried out ASMPT AMICRA-wise and to hold on to thriving spirits, we are happy to announce the publication of the technical article on “Revolutionizing optoelectronics with high-precision bonding” in PIC Magazine Issue III, pages 14-18. The printed article was published only the first day of ECOC in Frankfurt.

Co-packaged optics is a promising innovation for powering our increasingly data-intensive world. ASMPT SEMI Solutions & ASMPT AMICRA machines can meet the challenge of extreme precision at the manufacturing stage.