Co-packaged Optics: The Future Driving Force in Silicon Photonics and Big Data Markets

In the foreseeable future, Co-packaged Optics CPO is expected to be the main driver in communication particularly in Silicon Photonics SiPh market. It shortens the electrical path, resulting in greater energy savings, reduced heat generation and more efficient data transmission speed. Leading semiconductor companies in Taiwan, South Korea and United States are currently developing their own CPO solutions. Furthermore, the latest generation of Nvidia AI chip has been announced in Nvidia GTC 2024, which is designed to process vast amounts of data. It is anticipated that the new generation of photonics data transmission will be necessary to fully realize the potential of this emerging “big data” era.