27.01.2025
According to the technology roadmap of optical transceiver from Yole Group's report, the 200G VCSEL become more popular in 2025. As the demand for high-speed optical interconnects surges, driven by advancements in silicon photonics, ASMPT SEMI Solutions is at the forefront with our innovative MEGA series. Our fully automatic multi-chip bonding machines are designed to meet the increasing complexity of optical packaging.
With high-precision bonding technology accurate to ±1.5μm and patented dynamic alignment, the MEGA series supports a variety of components, including PD, VCSEL, TIA, EIC, COC and more. This flexibility ensures that we can tackle the challenging requirements of next-generation optical solutions.
Join us as we drive the revolution towards 1.6T optical transceivers, enabling faster, more efficient data transmission!
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Image source: Yole Group
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