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ASMPT Unveiling Packaging Solutions Enabling the AI World

10.01.2025

Singapore, January 10, 2025 – ASMPT will present at NEPCON Japan, January 22-24, 2025, at Tokyo Big Sight, Booth E66-28. The debut of a high-precision multi-chip bonder, MEGA, will mark its first appearance, presenting solutions tailored for communication in AI devices.

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