Accelerating AI through Advanced Packaging

AI, HPC and data center applications are driving increasingly complex semiconductor architectures, making advanced packaging a key enabler of future systems. ASMPT supports 2.5D and 3D packaging, chiplet and heterogeneous integration with technologies including Thermocompression Bonding (TCB) and Hybrid Bonding. Under the theme “Empower the Intelligence Revolution”, ASMPT will highlight its advanced packaging portfolio together with technologies for photonics and Co-Packaged Optics (CPO) at SEMICON West.

“Advanced packaging has become a key enabler for the next generation of AI,” says Jean-Marc Peallat, Regional Head ASMPT Semiconductor Solutions Americas. “The challenge is to turn increasingly complex semiconductor architectures into reliable, scalable manufacturing processes. This is where our broad advanced packaging portfolio and close collaboration with customers make a difference.”

High-precision wafer processing

One of the technologies highlighted at the ASMPT booth will be the ALSI LASER1206, the latest platform for laser dicing and grooving. Developed for the increasingly complex requirements of IDMs and foundries, the system processes a wide range of semiconductor materials used in advanced memory, logic, AI and power applications. Its patented multi-beam UV laser technology combines high-precision processing with minimal heat impact, helping to reduce burr formation and die-strength degradation.

The ALSI LASER1206 offers fully automated handling of film frames and bare wafers and integrates wafer coating and cleaning. Its planar motion system achieves positioning accuracy of less than 1.5 µm. For grooving, the system processes wafers from 60 to 800 µm thick; for dicing, the range is 20 to 200 µm.

Photonics moves toward volume production

Photonics and Co-Packaged Optics are another focus at SEMICON West. Integrating optical components such as glass dies, micro-lenses and photonic integrated circuits alongside high-performance processors places high demands on assembly precision and process control.

For volume production, however, precision alone is not enough. Alignment must remain stable throughout bonding and curing, while adhesive processing, inspection and metrology need to be tightly controlled. ASMPT brings these capabilities together with high-precision placement, vision alignment, in-line metrology and automation. This helps manufacturers reduce process variation, maintain consistent optical performance and move demanding photonics and CPO applications from development toward scalable production.