ASMPT Highlights Scalable Co-Packaged Optics Manufacturing at ECOC 2026

The transition towards Co-Packaged Optics (CPO) is driving new manufacturing requirements, including ultra-precise alignment, controlled adhesive processes and highly repeatable assembly workflows. At ECOC 2026 (21-23 September, FYCMA Malaga, Spain), ASMPT will showcase technologies designed to support the development and scalable production of next-generation photonic devices.

At Booth 2158, ASMPT will highlight AMICRA NANO, a Sub-Micron Precision Bonding Solution for advanced photonics assembly and process development; AMICRA NOVA, a High-Speed Photonics Bonding Solution for accurate, repeatable and high-throughput production; and MEGA, a Multi-Chip Bonding Solution for the assembly of complex multi-chip packages.

Under the theme "Empower the Intelligence Revolution", ASMPT will demonstrate how its advanced packaging and photonics manufacturing technologies enable high-performance optical interconnects for hyperconnectivity, supporting the growing demands of AI infrastructure and next-generation data communications.
Visit ASMPT at Booth 2158 to discover how scalable manufacturing technologies are helping accelerate the adoption of Co-Packaged Optics.

Join ASMPT at ECOC 2026

About ASMPT Limited (“ASMPT”)

ASMPT Limited is a leading global supplier of hardware and software solutions for the manufacture of semiconductors and electronics. Headquartered in Singapore, ASMPT’s offerings encompass the semiconductor assembly & packaging, and SMT (surface mount technology) industries, providing various solutions that organise, assemble and package delicate electronic components into a vast range of end-user devices. ASMPT partners with customers very closely, with continuous investment in R&D helping to provide cost-effective, industry-shaping solutions that achieve higher productivity, greater reliability, and enhanced quality. ASMPT is a founding member of the Semiconductor Climate Consortium.

About ASMPT Semiconductor Limited (“ASMPT SEMI”)

ASMPT SEMI is the leading supplier in advanced packaging and semiconductor assembly solutions. With a commitment to innovation and customer satisfaction, ASMPT SEMI provides a comprehensive range of products and services that cater to the evolving needs of the microelectronics industry. Their expertise spans across areas such as flip-chip and wafer-level packaging, advanced interconnect technologies, and more. ASMPT SEMI's cutting-edge solutions enable customers to achieve higher performance, increased reliability, and improved cost-efficiency when producing their semiconductor devices.

ASMPT SEMI sees itself as a pioneer and driving force of the Intelligence Revolution. With its advanced packaging and assembly technologies, the business segment creates the invisible connections that enable intelligent applications in Artificial Intelligence, Smart Mobility and Hyperconnectivity.