22.03.2024
At ISES USA 2024, ASMPT AMICRA will showcase its revolutionary Co-Packaged Optics (CPO) solutions, poised to revolutionize data center connectivity. By leveraging advanced packaging techniques, CPO technology significantly reduces electrical interconnect lengths while optimizing electronics and photonics, effectively addressing the escalating demands of AI, IoT, 5G, and high-performance computing applications.
Highlighting ASMPT AMICRA's unwavering commitment to shaping the future of optical communications, Dr. Johann Weinhändler, the esteemed Managing Director at ASMPT AMICRA, will deliver a captivating keynote speech on the first day of the conference. Dr. Johann's presentation will delve into the latest advancements in photonic devices, integrated circuit designs, packaging, co-simulation, and standardization. His valuable insights will drive the widespread adoption of CPO across the industry and pave the way for high-volume manufacturing.
"We are delighted to be part of ISES 2024 and presenting our Co-Packaged Optics (CPO) solutions," expressed Dr. Johann with enthusiasm. "CPO technology brings unparalleled advantages, including exceptional bandwidth density and energy efficiency, making it a game-changer for data centers. We eagerly anticipate engaging with industry leaders and stakeholders to delve into the vast potential of CPO and drive the progress of optical communications."
In addition to ISES USA 2024, ASMPT AMICRA is pleased to announce its participation in the upcoming ISES Taiwan 2024 conference in May, with a dedicated seminar focused on Co-Packaged Optics (CPO), catering to the Asian market. Attendees will be able to gain valuable insights and explore the unique advantages that CPO offers in the region.
For more information about ISES USA 2024, including registration details and conference agenda, please visit the official event website at ises-usa.com.
Media contacts: ASMPT Strategic Marketing Team (SEMI Solutions)
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Dr. Johann Weinhändler, Managing Director ASMPT AMICRA GmbH
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