Smart COB Inline CMOS Image Sensor Packaging Solution: Shaping the Future of Automotive Imaging

Source: Yole Intelligence 2024

Breakthroughs in Vehicle Imaging Rely on CIS Technology

Vehicle-mounted cameras are a core element of vision-oriented in-vehicle technology, assisting drivers in monitoring surrounding conditions and ensuring safety. ADAS systems, which rely on CIS as the primary visual sensors, have been widely adopted in the automotive industry.

As the automotive camera market expands, CIS manufacturers face several challenges in the camera production process, particularly in achieving optimal image clarity, precise alignment, and cost-effectiveness. These challenges need to be addressed to meet the growing demand for high-performance automotive cameras.

In the CIS assembly process, advanced die-bonding technology plays a crucial role in improving image clarity, while wire bonding and optical inspection (AOI) are key to ensuring the optimal performance of automotive cameras.

Key Processes

1. Die Bonding is a core part of the packaging process, directly impacting the performance, stability, and lifespan of CIS chips. Poor die bonding can adversely affect the performance and stability of the circuits.
2. Wire Bonding is an important means in the CIS packaging process. Through wire bonding, a stable connection can be ensured between the internal circuits of the CIS chip and the external circuits, thereby guaranteeing the normal operation of the CIS sensor.
3. AOI (Automated Optical Inspection) technology has high-precision and high-efficiency detection capabilities, allowing for comprehensive and rapid detection of minor defects in the CIS chip manufacturing process. This helps ensure the quality of CIS chips, improving product reliability and service life.  

ASMPT Smart COB Inline

As the leader in camera assembly, ASMPT provides comprehensive solutions for image sensor packaging, from die bonding to lens attachment and testing. Their Smart COB Inline Solution for CMOS Image Sensor Packaging is an integrated offering that combines excellent precision and adhesion performance.

This solution delivers optimal optical results while maintaining cost-effectiveness and maximizing production efficiency for both consumer and automotive image sensor packaging. By integrating critical technologies like die bonding, wire bonding, and lens attachment, the Smart COB Inline Solution provides an efficient, cost-effective approach to CIS packaging.

The patented technology employed in key processes enables higher efficiency and lower cost of ownership. Additionally, the solution is designed to AIoT (Artificial Intelligence of Things) standards, improving production automation. Its modular design offers flexibility and scalability to accommodate diverse manufacturing needs, optimizing the total cost of ownership and output quality.

Source: ASMPT

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