ASMPT invites you to join us at International Symposium on Microelectronics and Packaging (ISMP) 2024 held from 6 - 8 November 2024 at the Paradise Hotel Busan, Korea.
Mr. CK Lim is the keynote speaker of this event.
Topic & ASMPT Speaker:
About ISMP-IRSP ISMP-IRSP 2024 is the 22nd International Symposium on Microelectronics and Packaging joined with the 18th International Conference Reliability and Stress-Related Phenomena in Nanoelectronics. The ISMP organized by KMEPS (The Korean Microelectronics and Packaging Society) presents a valuable chance to share the latest electronic packaging technologies and IRSP discusses coupled electro-thermal-mechanical complexities in materials, devices, circuits, packages, and systems that crucially affect the design and technology of electronics.
活動詳情
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