12.03.2024
At booth 4125, ASMPT AMICRA will showcase its latest advancements in advanced packaging and assembly technologies, including the groundbreaking Co-Packaged Optics (CPO) solution and innovative packaging solutions. These cutting-edge technologies are designed to enhance bandwidth density, improve energy efficiency, and optimize connectivity in data centers.
"We are delighted to be a part of OFC 2024 for many years," said Dr. Weinhändler Johann, Managing Director at ASMPT AMICRA. "This year, we are excited to demonstrate our latest offerings in Co-Packaged Optics and Solutions, reinforcing our commitment to shaping the future of optical communications. We also look forward to gaining valuable insights into industry trends and developments during the event."
Co-Packaged Optics (CPO) technology is revolutionizing data center connectivity by reducing electrical interconnect lengths through advanced packaging and optimizing electronics and photonics. With the increasing data traffic driven by AI, IoT, 5G, and high-performance computing applications, CPO offers significant potential for boosting bandwidth density and energy efficiency in future data centers. Leading industry players such as Intel, Broadcom, and IBM have made substantial investments in CPO, driving advancements in photonic devices, integrated circuit designs, packaging, co-simulation, and standardization.
Visitors to OFC 2024 are invited to discover ASMPT AMICRA's booth, where they can engage with their team of experts, explore their cutting-edge solutions, and gain valuable insights into future trends and developments in the optical communications field.
For more information about OFC 2024, including dates, venue, and registration details, please visit the official event website.
Media contacts: ASMPT Strategic Marketing Team (SEMI Solutions)
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