We're thrilled to unveil the latest features of the AERO PRO XPOWER 2.0 – a cutting-edge leader in semiconductor wire bonding!
Regensburg (Germany), April 15, 2025 – At this year’s PCIM trade event in Nuremberg, ASMPT focuses on power electronics for the vehicle of the future at booth 145 in hall 6. With its comprehensive machine portfolio, the market and technology leader offers innovative solutions for the entire production process of automotive power modules.
Artificial Intelligent is advancing at an unprecedented pace, transforming our everyday experiences. From AI-powered vacuums to healthcare, finance, manufacturing, automotive, and consumer electronics such as AR glasses and SmartHome devices, these innovations are enhancing personalization and convenience like never before.
Why is MEGA Essential to This Innovation?
Automated Optical Inspection is a crucial step in the camera or sensor assembly and packaging process, ensuring that every component meets the highest quality standards. ASMPT SEMI Solutions CamSpector PRO is a groundbreaking 2-in-1 AOI system that not only detects foreign materials FM but also performs wire bond inspections.
At ASMPT SEMI Solutions, we are proud to launch our latest innovation – AERO PRO. Engineered for excellence, AERO PRO XPOWER 2.0 feature sets a new standard in the semiconductor equipment industry.
Billerica (USA), March 21, 2024 – ASMPT, the global market and technology leader for hardware and software solutions in the semiconductor and electronics industries, continues to drive the growth of its semiconductor solutions in strategically important markets. To do this, the company relies on experienced industry experts like Dr. Johann Weinhändler, who assumes the role of Regional Head ASMPT Semiconductor Solutions Europe, and Jean-Marc Peallat, PhD, who will take on the role of Regional Head ASMPT Semiconductor Americas. With these appointments, ASMPT is strengthening its market position, expanding its global presence, and underscoring its commitment to innovation paired with proximity to the customer.
Singapore, 3 March 2025 – ASMPT, the global market and technology leader in semiconductor and electronics manufacturing solutions achieved great success at SEMICON Korea 2025. The company showcased its latest cutting-edge hardware and software innovations, attracting significant attention from industry professionals, partners, and potential customers. By focusing on the “edge” of technology, ASMPT demonstrated how these innovations drive transformative change across industries, enabling the AI World. With the advanced solutions presented, ASMPT has once again underlined its leadership in the industry.
Singapore, February 18, 2025 – ASMPT, the global leader in semiconductor and electronics manufacturing solutions, will demonstrate its cutting-edge technologies at SEMICON Korea 2025, February 19-21, at COEX, Seoul (Hall D, Booth D432). Under the theme "Lead the Edge: ASMPT Enabling the AI World," the company will present innovations driving the future of intelligent manufacturing.
Wire bonding continues to be one of the most important connection technologies in electronics. To accommodate ever smaller more densely packaged components and new wire materials while meeting the need to become ever more efficient, including networking and monitoring every step, new solutions are needed.
【新加坡，2025年2月6日】— 全球協作型機器人領導品牌達明機器人（Techman Robot）與半導體製造技術的創新與市場領導者ASMPT正式簽署合作備忘錄（MOU），攜手推動智慧製造的全球化應用與創新。這次策略合作將整合雙方的技術與專業，共同迎接全球產業數位化轉型帶來的挑戰與機遇。
We would like to extend our heartfelt gratitude to EE Times Asia for the opportunity to discuss the critical role of the semiconductor industry in driving global economic recovery, particularly in relation to AI and sustainability. Our interviewee, Dr. Gary Widdowson, Chief Technology Officer, provided valuable insights into how the demand for high-performance chips continues to rise, driven by advancements in AI, electric vehicles, and next-generation communication technologies. Read the full interview of ASMPT Ltd below for a more comprehensive understanding of our initiatives and the exciting developments within the semiconductor sector.
According to the technology roadmap of optical transceiver from Yole Group's report, the 200G VCSEL become more popular in 2025. As the demand for high-speed optical interconnects surges, driven by advancements in silicon photonics, ASMPT SEMI Solutions is at the forefront with our innovative MEGA series. Our fully automatic multi-chip bonding machines are designed to meet the increasing complexity of optical packaging.
We are thrilled to share the latest semiconductor market forecast from the World Semiconductor Trade Statistics organization, which predicts robust growth for 2024 and 2025!
Singapore, January 10, 2025 – ASMPT will present at NEPCON Japan, January 22-24, 2025, at Tokyo Big Sight, Booth E66-28. The debut of a high-precision multi-chip bonder, MEGA, will mark its first appearance, presenting solutions tailored for communication in AI devices.
Singapore, December 12, 2024 – ASMPT Limited, Kaynes Semicon Private Limited and Perceptives Solutions today signed two Memorandum of Understanding (MoUs) aimed at enhancing semiconductor expertise through targeted training and knowledge sharing to strengthen India’s semiconductor ecosystem.
Exciting insights from the semiconductor industry! Check out our interview with Dr. Gary Widdowson, CTO of ASMPT SEMI Solutions, where he discusses the latest trends in semiconductor manufacturing, the importance of innovation, and ASMPT's commitment to sustainability.
Munich (Germany), October 14, 2024 – The Electronica 2024, one of the world’s most important trade fairs for electronics being held from November 12 to 15, will once again bring leading experts, users and manufacturers to Munich. ASMPT will present its latest technical innovations in the field of bonding for co-packaged optics components and power modules in Hall C, Booth 300.
New Delhi, India, September 10, 2024 – In a significant step towards accelerating readiness for the Tata Electronics semiconductor assembly and test facilities in Vemagal, Karnataka and Jagiroad, Assam, Tata Electronics (a wholly-owned subsidiary of Tata Sons Pvt. Ltd.) signed a Memorandum of Understanding (MOU) with ASMPT to collaborate on establishing semiconductor assembly equipment infrastructure and solutions.
Singapore, August 19, 2024 – ASMPT Limited will exhibit trendsetting semiconductor assembly and packaging equipment at SEMICON India 2024, Greater Noida, September 11 – 13, 2024, IEML, Booth H1V01. The trade fair, coinciding with electronica and productronica India, is regarded as the most important meeting of the electronics industry in South Asia.
新加坡，2024年8月19日 – 全球領先之半導體及電子產品製造硬件及軟件解決方案供應商 ASMPT Limited 將於9 月 4 日至 6 日參展亞洲首屈一指的半導體年度盛會 —— SEMICON Taiwan 2024 國際半導體展。ASMPT 將於台北南港展覽館(TaiNEX) 1 館展位N0762展示其先進系統 NUCLEUS XLplus、POWER VECTOR及VORTEX II，涵蓋人工智能（AI）、智能汽車和智慧工廠解決方案等三大範疇。
[Singapore, August 09, 2024] – ASMPT Limited (HKEX stock code: 0522), the world’s leading maker of integrated solutions for the manufacture of semiconductors and electronics, was recently honoured with the 2023 Supplier Excellence Award from Texas Instruments (TI) for the second year running. This prestigious recognition underscores ASMPT's unmatched commitment to excellence in supplying products and services that consistently meet TI’s high standards.
The Yole Group's recent forecast report reveals that the automotive camera market is expected to reach a value of $8.4 billion by 2029. Image sensors (CIS) and ADAS (Advanced Driver Assistance Systems) cameras are projected to account for 80% of the market share, driven by the growing demand for autonomous driving and high-resolution cameras.
At ASMPT Ltd, we are passionate about pushing the boundaries of automotive innovation. Gone are the days of bulky, static displays that simply provide basic driving information. Today's drivers demand more - an immersive, intuitive, and seamlessly integrated interface that enhances the overall driving experience. By the advancement of Mini/ Micro LED technology, we can enjoy the unprecedented infotainment in automotive. Let's explore and experience with us.
ASMPT MEGA series of fully automatic multi-chip bonding machines feature high-precision bonding technology accurate to ±1.5μm and patented dynamic alignment technology. MEGA series supports various components such as photodiodes PD, vertical cavity surface emitting lasers VCSEL, transimpedance amplifiers TIA, electronic integrated circuits EIC, and chip-on-chip COC. The flexible machine configuration enables handling complex multi-chip packaging requirements in a single machine.
In the semiconductor industry chain, the three key nodes of chip design, wafer manufacturing, packaging and testing constitute the complete process of chip manufacturing.
In the foreseeable future, Co-packaged Optics CPO is expected to be the main driver in communication particularly in Silicon Photonics SiPh market. It shortens the electrical path, resulting in greater energy savings, reduced heat generation and more efficient data transmission speed. Leading semiconductor companies in Taiwan, South Korea and United States are currently developing their own CPO solutions. Furthermore, the latest generation of Nvidia AI chip has been announced in Nvidia GTC 2024, which is designed to process vast amounts of data. It is anticipated that the new generation of photonics data transmission will be necessary to fully realize the potential of this emerging “big data” era.
Building Trust with Suppliers: Key to High Customer Satisfaction
The EU approved a law that will ban the sale of combustion engine cars in its member states from 2035. To achieve zero CO2 emissions by 2050, new energy vehicles, such as electricity, hydrogen or solar energy, are developed for replacement.
台灣 | 台北
德國 | 慕尼黑
德國 | 紐倫堡
新加坡
美國 | 亞利桑那州
美國 | 德薩斯州
丹麥 | 哥本哈根
德國 | 德勒斯登
美國 | 底特律
5