EPTC 2023

ASMPT 邀請您與我們一起參加在 2023 年 12 月 5 日 - 8 日舉辦的 EPTC 2023，地點為新加坡的國敦河畔大酒店 。

ASMPT 很榮幸作為此活動的贊助商。

日期: 2023 年 12 月 5 日 - 8 日
地點: 新加坡 國敦河畔大酒店

INVITED TALK about Advanced Packaging Technology
Topic: "The Era of Generative AI and Advanced Packaging"
Speaker: Tommy Chak
Title: Senior Manager, Strategic Marketing, ASMPT SEMI Solutions
Date: 7 Dec 2023
Time: 08:30 - 09:00
Venue: Pelican Hall

HETEROGENEOUS INTEGRATION ROADMAP (HIR) FORUM – Keynote Address
Speaker: Lim Choon Khoon
Title: Senior Vice President, ASMPT SEMI Solutions
Date: 8 Dec 2023
Time: 13:25 – 14:00
Venue: Canary 1 / Canary 2

關於 EPTC
The 25th IEEE Electronics Packaging Technology Conference (EPTC2023) is an international event organized by the IEEE RS/EPS/EDS Singapore Chapters and co-sponsored by the IEEE Electronics Packaging Society (EPS). Since its inauguration in 1997, EPTC has been established as a highly reputable international electronics packaging conference and is the IEEE EPS flagship conference in the Asia and Pacific Region. It aims to cover the complete spectrum of electronic packaging technology. Topics include modules, components, materials, equipment technology, assembly, reliability, interconnect design, device and systems packaging, heterogeneous integration, wafer-level packaging, flexible electronics, LED, IoT, 5G, emerging technologies, 2.5D/3D integration technology, smart manufacturing, automation, and AI. EPTC2023 will feature keynotes, technical sessions, invited talks, panels, workshops, exhibitions, and networking activities.

活動詳情