ASMPT will be participating in the highly anticipated 21th Annual Device Packaging Conference (DPC 2025) organized by the International Microelectronics Assembly and Packaging Society (IMAPS) at the Sheraton Grand at Wild Horse Pass in Phoenix, Arizona from 3 - 6 March 2025.
We invite you to visit the ASMPT booth at the conference where you can discover our innovative solutions, engage in insightful conversations with our experts, and learn how ASMPT is shaping the future of advanced packaging technologies. We will showcase our latest offerings and interact with industry professionals at our booth.
ASMPT is a proud sponsor of this event.
Date: 3 - 6 March 2025 | Meeting with us in the Event Location: Sheraton Grand at Wild Horse Pass in Phoenix, Arizona, USA Booth: 405
About iMAPS The International Microelectronics Assembly and Packaging Society is the largest society dedicated to the advancement and growth of microelectronics and electronics packaging. Worldwide, IMAPS offers educational and marketing opportunities for industry professionals, packaging organizations, and students through technical conferences and workshops, professional development courses, IMAPSource microelectronics packaging research library, local chapters, and exhibitions. The Society encompasses a wide-range of technologies and topics critical to microelectronics assembly and packaging, including: on-shoring, heterogenous integration, fan-out wafer level packaging, 2.5D/3D technologies, system-in-package, photonics/optical, power packaging, CPI, package design/modeling, interconnects, wire bonding, flip chip, MEMS, sensors, packaging for 5g/6g, RF/wireless, signal/power integrity, advanced materials, substrates and more.
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