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iMAPS | Device Packaging

ASMPT will be participating in the highly anticipated 21th Annual Device Packaging Conference (DPC 2025) organized by the International Microelectronics Assembly and Packaging Society (IMAPS) at the Sheraton Grand at Wild Horse Pass in Phoenix, Arizona from 3 - 6 March 2025.

We invite you to visit the ASMPT booth at the conference where you can discover our innovative solutions, engage in insightful conversations with our experts, and learn how ASMPT is shaping the future of advanced packaging technologies. We will showcase our latest offerings and interact with industry professionals at our booth.

ASMPT is a proud sponsor of this event.


Date: 3 - 6 March 2025 | Meeting with us in the Event
Location: Sheraton Grand at Wild Horse Pass in Phoenix, Arizona, USA
Booth: 405


About iMAPS (International Microelectronics Assembly and Packaging Society)
The conference is a major forum for the exchange of knowledge and provides numerous technical, social and networking opportunities for meeting leading experts in these fields.

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