ASMPT 半導體解決方案
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  • 先進封裝
  • 集成電路及分立器件
  • CMOS影像感測器
  • LED / Photonics
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汽車輔助系統需要堅固、可靠且精確的雷達 (RADAR)、光達 (LiDAR) 和光電感測器。這項技術的一個例子是相機,其鏡頭在生產過程中必須與感測器晶片完美對齊。

ASMPT AUTOPIA 是此流程的創新解決方案。憑藉其主動對準 (Active Alignment) 功能,可以讀取 CMOS 感測器的影像訊號,並在定位鏡頭時將其與參考影像值進行比較。像 SIPLACE CA(晶片組裝)這樣的貼裝解決方案可以將感測器和裸晶與 SMT 組件結合,形成緊湊的 SiP(系統級封裝)

AUTOPIA

Active Lens Alignment for Car Cameras

  • High volume production
  • Automated precision loading & unloading
  • 11 Degrees of Freedom
  • Configurable production sequence

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AMICRA CoS

Chip to Submount bonding

  • Accuracy: ± 1.5µm @ 3σ (local alignment)
  • Upto 16x16mm substrate handling
  • Flip chip handling (Option)
  • Dynamic Alignment

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AMICRA Nova+

Photonics and Semi applications

  • Accuracy: ± 1.0µm @ 3σ (local alignment)
  • Up to 550mm x 600mm substrate handling
  • Fully automatic system
  • Flip chip handling (Option)

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ALSI Laser1205

VCSEL Dicing

  • Narrow dicing width using multi beam (typically 20um)
  • High feed speed (typically 200mm/s)
  • IP on wet etch post processing
  • Kerf check on the fly

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