Meet ASMPT at SEMICON Europa 2026

ASMPT will participate in SEMICON Europa 2026 from 10-13 November in Munich, Germany, showcasing innovations that support the growing demands of Artificial Intelligence and Hyperconnectivity. At Booth C1/529, visitors can explore ASMPT's latest solutions for high-precision die bonding, photonics assembly, multi-chip integration, and laser processing, represented by the AMICRA NANO, AMICRA NOVA, MEGA, and ALSI LASER1206 platforms. These technologies enable advanced packaging, silicon photonics, and Co-Packaged Optics (CPO), helping create the high-performance electrical and optical interconnections required for next-generation AI infrastructure.

Under the theme "Empower the Intelligence Revolution," ASMPT will demonstrate how its advanced packaging and semiconductor manufacturing technologies are helping accelerate the adoption of AI, high-performance computing, and hyperconnected systems

Meet ASMPT at SEMICON Europa 2026

About ASMPT Limited (“ASMPT”)

ASMPT Limited is a leading global supplier of hardware and software solutions for the manufacture of semiconductors and electronics. Headquartered in Singapore, ASMPT’s offerings encompass the semiconductor assembly & packaging, and SMT (surface mount technology) industries, providing various solutions that organise, assemble and package delicate electronic components into a vast range of end-user devices. ASMPT partners with customers very closely, with continuous investment in R&D helping to provide cost-effective, industry-shaping solutions that achieve higher productivity, greater reliability, and enhanced quality. ASMPT is a founding member of the Semiconductor Climate Consortium.

About ASMPT Semiconductor Limited (“ASMPT SEMI”)

ASMPT SEMI is the leading supplier in advanced packaging and semiconductor assembly solutions. With a commitment to innovation and customer satisfaction, ASMPT SEMI provides a comprehensive range of products and services that cater to the evolving needs of the microelectronics industry. Their expertise spans across areas such as flip-chip and wafer-level packaging, advanced interconnect technologies, and more. ASMPT SEMI's cutting-edge solutions enable customers to achieve higher performance, increased reliability, and improved cost-efficiency when producing their semiconductor devices.
ASMPT SEMI sees itself as a pioneer and driving force of the Intelligence Revolution. With its advanced packaging and assembly technologies, the business segment creates the invisible connections that enable intelligent applications in Artificial Intelligence, Smart Mobility and Hyperconnectivity.