Meet ASMPT at SEMICON India 2026

ASMPT will participate in SEMICON India 2026 from 17-19 September at Yashobhoomi (IICC), New Delhi, India. As India continues its journey toward becoming a global semiconductor powerhouse, ASMPT is proud to support the growth of the country's semiconductor ecosystem through advanced assembly and packaging technologies.

At Booth 1346, Hall 1, visitors can discover ASMPT's latest semiconductor assembly solutions, including AERO PRO fine-pitch wire bonding and INFINITE ultra-fast die bonding technologies, designed to enable next-generation AI, Smart Mobility and Hyperconnectivity applications.

Join our experts to explore how ASMPT is helping Empower the Intelligence Revolution and supporting the future of semiconductor innovation in India.

Meet ASMPT at SEMICON India 2026

About ASMPT Limited (“ASMPT”)

ASMPT Limited is a leading global supplier of hardware and software solutions for the manufacture of semiconductors and electronics. Headquartered in Singapore, ASMPT’s offerings encompass the semiconductor assembly & packaging, and SMT (surface mount technology) industries, providing various solutions that organise, assemble and package delicate electronic components into a vast range of end-user devices. ASMPT partners with customers very closely, with continuous investment in R&D helping to provide cost-effective, industry-shaping solutions that achieve higher productivity, greater reliability, and enhanced quality. ASMPT is a founding member of the Semiconductor Climate Consortium.

About ASMPT Semiconductor Limited (“ASMPT SEMI”)

ASMPT SEMI is the leading supplier in advanced packaging and semiconductor assembly solutions. With a commitment to innovation and customer satisfaction, ASMPT SEMI provides a comprehensive range of products and services that cater to the evolving needs of the microelectronics industry. Their expertise spans across areas such as flip-chip and wafer-level packaging, advanced interconnect technologies, and more. ASMPT SEMI's cutting-edge solutions enable customers to achieve higher performance, increased reliability, and improved cost-efficiency when producing their semiconductor devices.
ASMPT SEMI sees itself as a pioneer and driving force of the Intelligence Revolution. With its advanced packaging and assembly technologies, the business segment creates the invisible connections that enable intelligent applications in Artificial Intelligence, Smart Mobility and Hyperconnectivity.