Singapore, January 10, 2025 – ASMPT will present at NEPCON Japan, January 22-24, 2025, at Tokyo Big Sight, Booth E66-28. The debut of a high-precision multi-chip bonder, MEGA, will mark its first appearance, presenting solutions tailored for communication in AI devices.
Using a plasma-based approach, active oxide removal technology empowers 3D chiplet integration and the HBM devices with fine bump pitch roadmaps and new package architectures. Residue-free fluxess bonding is ready for prime time.
Singapore, December 12, 2024 – ASMPT Limited, Kaynes Semicon Private Limited and Perceptives Solutions today signed two Memorandum of Understanding (MoUs) aimed at enhancing semiconductor expertise through targeted training and knowledge sharing to strengthen India’s semiconductor ecosystem.
Exciting insights from the semiconductor industry! Check out our interview with Dr. Gary Widdowson, CTO of ASMPT SEMI Solutions, where he discusses the latest trends in semiconductor manufacturing, the importance of innovation, and ASMPT's commitment to sustainability.
Munich (Germany), October 14, 2024 – The Electronica 2024, one of the world’s most important trade fairs for electronics being held from November 12 to 15, will once again bring leading experts, users and manufacturers to Munich. ASMPT will present its latest technical innovations in the field of bonding for co-packaged optics components and power modules in Hall C, Booth 300.
New Delhi, India, September 10, 2024 – In a significant step towards accelerating readiness for the Tata Electronics semiconductor assembly and test facilities in Vemagal, Karnataka and Jagiroad, Assam, Tata Electronics (a wholly-owned subsidiary of Tata Sons Pvt. Ltd.) signed a Memorandum of Understanding (MOU) with ASMPT to collaborate on establishing semiconductor assembly equipment infrastructure and solutions.
Singapore, August 19, 2024 – ASMPT Limited will exhibit trendsetting semiconductor assembly and packaging equipment at SEMICON India 2024, Greater Noida, September 11 – 13, 2024, IEML, Booth H1V01. The trade fair, coinciding with electronica and productronica India, is regarded as the most important meeting of the electronics industry in South Asia.
Singapore, August 19 2024 – ASMPT Limited, the world's leading provider of hardware and software solutions for the semiconductor and electronics industries, will be exhibiting at SEMICON Taiwan 2024, Asia's leading electronics manufacturing event, from 4-6 September. ASMPT will showcase its advanced systems, NUCLEUS XLplus, POWER VECTOR, and VORTEX II, across three zones covering AI, Smart Automotive, and Intelligent Factory solutions at Booth N0762, TaiNEX 1&2.
The Yole Group's recent forecast report reveals that the automotive camera market is expected to reach a value of $8.4 billion by 2029. Image sensors (CIS) and ADAS (Advanced Driver Assistance Systems) cameras are projected to account for 80% of the market share, driven by the growing demand for autonomous driving and high-resolution cameras.
[Singapore, August 09, 2024] – ASMPT Limited (HKEX stock code: 0522), the world’s leading maker of integrated solutions for the manufacture of semiconductors and electronics, was recently honoured with the 2023 Supplier Excellence Award from Texas Instruments (TI) for the second year running. This prestigious recognition underscores ASMPT's unmatched commitment to excellence in supplying products and services that consistently meet TI’s high standards.
At ASMPT Ltd, we are passionate about pushing the boundaries of automotive innovation. Gone are the days of bulky, static displays that simply provide basic driving information. Today's drivers demand more - an immersive, intuitive, and seamlessly integrated interface that enhances the overall driving experience. By the advancement of Mini/ Micro LED technology, we can enjoy the unprecedented infotainment in automotive. Let's explore and experience with us.
ASMPT MEGA series of fully automatic multi-chip bonding machines feature high-precision bonding technology accurate to ±1.5μm and patented dynamic alignment technology. MEGA series supports various components such as photodiodes PD, vertical cavity surface emitting lasers VCSEL, transimpedance amplifiers TIA, electronic integrated circuits EIC, and chip-on-chip COC. The flexible machine configuration enables handling complex multi-chip packaging requirements in a single machine.
In the semiconductor industry chain, the three key nodes of chip design, wafer manufacturing, packaging and testing constitute the complete process of chip manufacturing.
In the foreseeable future, Co-packaged Optics CPO is expected to be the main driver in communication particularly in Silicon Photonics SiPh market. It shortens the electrical path, resulting in greater energy savings, reduced heat generation and more efficient data transmission speed. Leading semiconductor companies in Taiwan, South Korea and United States are currently developing their own CPO solutions. Furthermore, the latest generation of Nvidia AI chip has been announced in Nvidia GTC 2024, which is designed to process vast amounts of data. It is anticipated that the new generation of photonics data transmission will be necessary to fully realize the potential of this emerging “big data” era.
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The EU approved a law that will ban the sale of combustion engine cars in its member states from 2035. To achieve zero CO2 emissions by 2050, new energy vehicles, such as electricity, hydrogen or solar energy, are developed for replacement.
Seoul, Korea
Shanghai, China
San Francisco, CA, USA
Tokyo, Japan
Taipei, Taiwan
Munich, Germany
Nuremberg, Germany
Phoenix, AZ, USA
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