SEMICON China 2024

ASMPT invites you to join us at SEMICON China 2024 held from 20 - 22 March at the Shanghai New International Expo Centre in Shanghai, China.

ASMPT SEMI Solutions segment will be showcasing the following machines:

• LOTUS12: Automatic Die Bonder
• Eagle AERO: Automatic Wire Bonder
• LA-PRO: Automatic Lens Holder Bonder
• Photon Pro: Automatic High Precision Die Bonder

These machines offer exceptional capabilities for various industries. We invite you to visit our booth and witness live demos of these cutting-edge machines. Our team of experts will be available to provide detailed demonstrations and answer any questions you may have.

Date: 20 - 22 March 2024
Location: Shanghai New International Expo Centre, Shanghai, China
Booth: 3451, Hall N3 | Meeting with us in the Event

About SEMICON China
SEMICON China connects you to the world's fastest-growing and most dynamic microelectronics market, and gives you the platform to showcase your products, technologies, and brand in front of the most qualified audience of industry professionals in China.

Event Details