Introducing XPOWER 2.0: Revolutionizing Wire Bonding in Semiconductor Manufacturing!

What is XPOWER 2.0?

Our AERO Bonder features a completely redeveloped transducer at its core. The AEROducer is made of innovative composites that are lightweight, stiff and durable. As a result, the AEROducer breaks the boundaries between classic table scrubbing and wire bonding without table scrubbing. Fast, flexible and precise, it represents a significant leap in productivity that opens up new application areas in high-density technologies.

• Superior Performance: Higher quality, reliability & productivity
• Latest Innovation: Enable patented technology - AEROducer
• Unmatched Precision: Cutting-edge technology ensuring high accuracy and quality

Elevate your manufacturing capabilities with the power of XPOWER 2.0!

Discover more about the XPOWER 2.0 and how it can enhance your production processes.