NUCLEUS Series

Features

• Driver of Fan-out and embedded packaging with
  • Supporting flip chip and direct die attach mode with local and global alignment, including flux dipping
• Capable of direct handling of bare wafer substrate, wafer on carrier or substrate on carrier
• Support high bond force and thermal process
• Multi-chip bonding capability with an automatic tool changing system
• Class 100 cleaning standard during bonding

Other configurations catering to the market

• NUCLEUS XD with extra large die handling capability up to 70mm x 70mm
• NUCLEUS XLplus with extra large substrate handling capability up to 600mm x 670mm

Brochure