The digital world is undergoing a fundamental transformation – driven by systems and machines that autonomously interpret data, learn, and act. Technologies like AI, electric vehicles, data centers, and 5G/6G are reshaping entire industries.
Devices are becoming intelligent, requiring:
This accelerates demand for advanced and more sophisticated semiconductor packaging – faster, smarter, more powerful.
ASMPT SEMI Solutions is at the forefront of this evolution, delivering the technologies that empower this intelligent revolution.
ASMPT – Enabling the digital world
Metallisation & Wafer Singulation Solutions
Camera Module & Assembly & Inspection Solutions
Die Attach & Wire Bonding Solutions
Fan-Out Solutions
Thermo-Compression & Hybrid Bonding Solutions
Optoelectronics & Photonics Assembly Solutions
Sintering & Encapsulation Solutions
ASMPT SEMI’s advanced packaging solutions for Artificial Intelligence and High-Performance Computing (HPC) enable next-generation AI accelerators and memory modules through sub-10μm interconnects, chiplet integration, and high-bandwidth memory stacking. Key offerings include industry-leading thermo-compression and hybrid bonding, high-precision die and wire bonding, and multi-chip System-in-Package (SiP) tools, supporting ultra-dense, reliable, and high-performance 2.5D/3D architectures for AI, edge, and cloud applications.
Thermocompression Bonding Solution
Thermocompression bonding for heterogeneous integration
Hybrid Bonding Solution
D2W hybrid bonding breakthrough for 3D integration
Ultra-Fast Die Bonding Solution
High speed die bonding with intelligent force control
Fine-Pitch Wire Bonding Solution
Quality assured wire bondong solution with X-Power thermosonic bonding technology
Multi-Chip Bonding Solution
Automatic high precision multi-chip die bonder for diverse multi-chip packages
Wafer- & Panel-Level Pick-&-Place Solution
Large-scale precision for fan-out packaging
Multi-Beam Dicing Solution
Precision SiC dicing for automotive power modules
Panel ECD Plating Solution
Advanced electroplating for dense IC packages
Universal Camera Module Assembly Solution
Universal die and lens holder bonding solution for camera modules
Dual-Mode Inspection Solution
2-in-1 AOI for CMOS assembly verification
ASMPT Semiconductor Solutions delivers comprehensive smart mobility solutions for automotive electronics, featuring advanced packaging and assembly systems for ADAS, LiDAR, and SiC power modules. Our portfolio includes high-precision die bonders, active alignment, wire bonding, and sintering, enabling robust, high-yield, and reliable production of next-generation automotive sensor and power systems.
Die Tacking Solution for Ag/Cu Sintering
Die, clip and component tacking solution for silver sintering
Silver Sintering Solution
Oxidation-free, copper-friendly Sintering Solution for Power Modules
Transfer Molding Solution
High-density encapsulation for automotive packages
Power Module Molding Solution
Flexible molding system for large power components
Eutectic Die Bonding Solution
Automatic eutectic die bonder with controlled heating
Automotive Camera Active Alignment Assembly Solution
All-in-one active alignment solution for camera module assembly
ASMPT Semiconductor Solutions’ hyperconnectivity solutions leverage ultra-high precision die attach, advanced optical packaging, and flexible bonding technologies to enable integration of optical and electronic components for high-speed, low-loss connections in AI accelerators, data centres, and telecommunication networks. Key offerings such as ultra precision die and flip chip bonding, multi-chip module assembly, wire bonding, and laser singulation tools support the assembly of next-generation photonic, RF, and high-speed logic modules, meeting the bandwidth and energy efficiency demands of 5G/6G, AI clusters, and critical applications across multiple industries.
Precision Bonder
Ultra-precision placement for co-packaged optics assembly
Hybrid Bond Master
Ultra-precision hybrid bonding for co-packaged optics
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