10.03.2026
Billerica (USA), March 10, 2026 – ASMPT will exhibit at the Optical Fiber Communication Conference and Exhibition (OFC) from March 17–19, 2026, at Booth #221 at the Los Angeles Convention Center. Under the theme “Empower the Intelligence Revolution,” ASMPT will present advanced bonding solutions designed to support the next generation of co-packaged optics (CPO), silicon photonics, and high-density optical modules: AMICRA NANO, the sub-micron precision bonding solution for co-packaged optics assembly, AMICRA NOVA, the high-speed photonics bonding solution, and MEGA, the automatic high-precision multi-chip bonding solution.
As AI-driven applications and cloud infrastructures continue to accelerate data traffic, optical interconnect technologies must deliver higher bandwidth and lower latency. At OFC, ASMPT demonstrates how precision automation enables scalable, reliable, and high-throughput assembly of photonic and optoelectronic devices for data centers and telecommunications networks. “As data demands grow and networks scale, co-packaged optics is redefining high-speed connectivity. ASMPT drives this evolution with precision automation that delivers scalability, energy efficiency, and ultra-low latency for next-generation computing in the era of AI and hyperconnectivity,” says Dr. Johann Weinhändler, Managing Director of ASMPT AMICRA and Regional Head, ASMPT Semiconductor Solutions Europe. “We will present three bonding platforms that are already enabling advanced CPO manufacturing and high-precision photonic integration.”
“The digital transformation is rapidly advancing, driven by artificial intelligence, networked communication, electromobility, and new high-performance data centers. At the same time, the demands on electronics manufacturers are increasing as well and presenting them with major challenges,” says Thomas Bliem, VP R&D at ASMPT SMT Solutions. “This is why the industry needs a technology boost right now – and that's what we are delivering with the new SIPLACE platform, which enables real productivity increases and fits seamlessly into our holistic concept of the intelligent factory.”
Sub-micron accuracy for co-packaged optics
AMICRA NANO is ASMPT’s ultra-precision die-bonder engineered for applications requiring sub-micron placement accuracy of ±0.2 µm. Its die-bonding and flip-chip capabilities enable highly accurate integration of optical and electronic components — a critical requirement for high-speed optical transceivers and co-packaged optics (CPO) modules. By ensuring exceptional placement stability and repeatability, AMICRA NANO supports the production of ultra-high-bandwidth, low-loss interconnects used in AI accelerators and advanced data center architectures. The platform provides a reliable foundation for precision assembly in silicon photonics and CPO environments where alignment tolerances are extremely tight.
High-throughput bonding for silicon photonics
For applications requiring higher throughput, ASMPT offers the AMICRA NOVA high-speed photonics bonding solution. The system is designed for fast and reliable bonding of co-packaged optics, silicon photonics devices, and VCSEL components, as well as for the assembly of photodiodes (PDs) and optical transceivers. With placement accuracy of ±1 µm, AMICRA NOVA utilizes fibre-laser technology for high-speed gold-tin (AuSn) eutectic bonding. Dynamic alignment, high-resolution imaging, and a vibration-damped granite base ensure stable and repeatable process performance. Optimized for production efficiency, AMICRA NOVA enables shorter cycle times and a high degree of automation, helping manufacturers scale photonic device production while maintaining precision and process reliability.
Flexible multi-chip integration for advanced photonic modules
Also on display at OFC is the highly versatile MEGA multi-chip bonding solution. MEGA uses patented look-through pattern recognition technology to ensure precise alignment and high-throughput integration of multiple chips. The system supports a wide range of multi-chip packages, including the assembly of complex photonic devices for data centers and telecommunications networks. It offers various epoxy dispensing and stamping functions, as well as the ability to process multiple adhesives simultaneously while monitoring their application with an integrated 3D inspection system. This combination of alignment capability, adhesive flexibility, and in-line inspection supports controlled and repeatable multi-chip assembly in advanced photonic packaging environments.
The MEGA’s customizable options meet the packaging requirements of sophisticated multi-chip components, making it the bonder of choice for optical transceivers, photonics, sensors, and other highly advanced applications.
Image credit: ASMPT
AMICRA NANO was the first bonding solutions in the industry to achieve a placement accuracy of< ± 0.2 μm at 3 sigma.
AMICRA NOVA combines high placement accuracy with short cycle times and innovative bonding technologies.
About ASMPT Limited (“ASMPT”)
ASMPT Limited is a leading global supplier of hardware and software solutions for the manufacture of semiconductors and electronics. Headquartered in Singapore, ASMPT’s offerings encompass the semiconductor assembly & packaging, and SMT (surface mount technology) industries, ranging from wafer deposition to the various solutions that organize, assemble and package delicate electronic components into a vast range of end-user devices, which include electronics, mobile communications, computing, automotive, industrial and LED (displays). ASMPT partners with customers very closely, with continuous investments in R&D helping to provide cost-effective, industry-shaping solutions that achieve higher productivity, greater reliability, and enhanced quality. ASMPT is a founding member of the Semiconductor Climate Consortium.
To learn more about ASMPT, please visit www.asmpt.com.
About ASMPT SMT Solutions
The mission of the SMT Solutions segment within ASMPT is to implement and support the Intelligent Factory at electronics manufacturers worldwide.
ASMPT solutions support the networking, automation, and optimization of central workflows with hardware, software and services that enable electronics manufacturers to transition to the Intelligent Factory in stages and enjoy dramatic improvements in productivity, flexibility, and quality. With its integrated open automation concept, ASMPT opens the door for its customers to economically feasible automation, entirely in accordance with their individual requirements – modular, flexible, and vendor-independent.
The product range includes hardware and software such as SIPLACE placement solutions, DEK printing solutions, inspection and storage solutions, and the WORKS Software Suite. With WORKS, ASMPT offers electronics manufacturers high-quality software for planning, controlling, analyzing and optimizing all processes on the shop floor. Maintaining close relationships with customers and technology partners is a central component of ASMPT’s strategy.
For more information about ASMPT SMT Solutions, visit smt.asmpt.com.
About ASMPT Semiconductor Solutions (“ASMPT SEMI”)
ASMPT SEMI is the leading supplier in advanced packaging and semiconductor assembly solutions. With a commitment to innovation and customer satisfaction, ASMPT SEMI provides a comprehensive range of products and services that cater to the evolving needs of the microelectronics industry. Their expertise spans across areas such as flip-chip and wafer-level packaging, advanced interconnect technologies, and more. ASMPT SEMI's cutting-edge solutions enable customers to achieve higher performance, increased reliability, and improved cost-efficiency when producing their semiconductor devices.
ASMPT SEMI sees itself as a pioneer and driving force of the Intelligence Revolution. With its advanced packaging and assembly technologies, the business segment creates the invisible connections that enable intelligent applications in Artificial Intelligence, Smart Mobility and Hyperconnectivity.
For more information about ASMPT SEMI, visit semi.asmpt.com.
Media contacts: ASMPT Strategic Marketing Team (SEMI Solutions)
Media contacts:
Global ASMPT Press Office
ASMPT Limited Susanne Oswald Rupert-Mayer-Strasse 48 81379 Munich Germany Phone: +49 89 20800-26439 E-Mail: susanne.oswald@asmpt.com Website: asmpt.com
HighTech communications GmbH Barbara Ostermeier Brunhamstrasse 21 81249 Munich Germany Phone: +49-89 500778-10 E-Mail: b.ostermeier@htcm.de Website: www.htcm.de
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