05.01.2026
Singapore, January 5, 2025 – ASMPT will be exhibiting at NEPCON Japan from January 21 to 23, 2026. At booth E32-1t 1 in East Hall 7 of Tokyo Big Sight. The leading manufacturer of semiconductor manufacturing solutions will present its latest developments under the theme “Empower the Intelligence Revolution.” This refers to the great importance of modern chip designs and packaging technologies for AI systems and other current developments such as smart mobility and hyperconnectivity. ASMPT will provide information on a wide range of aspects of advanced packaging. The high-performance wire bonder AERO PRO will be on display at the booth.
ASMPT SEMI Solutions is the pioneer, and enabler of the ‘Intelligence Revolution, ’ says Takebumi Ochiai, Office Head at ASMPT Japan Ltd. „Our advanced packaging and high-end mainstream assembly solutions create tools for the invisible connections that make any kind of smart device, vehicle, and every data center much more intelligent.”
The AERO PRO, showcased at NEPCON, is ASMPT's fine-pitch wire bonding solution for high-density semiconductor packages such as system-in-package (SiP), multi-chip modules (MCM), ball grid array (BGA), and land grid array (LGA). A new feature is the patented vertical wire bonding technology, GoV. It ensures excellent wire straightness and increases the stability and long-term reliability of wire connections under high electrical and thermal loads.
The patented XPOWER ultrasonic transducer, which produces uniform 22 µm bond balls, supports mixed wire and vertical wire bonding in bond-via-array (BVA) technology and is optimised for complex connections, for example in memory modules or microcontroller units (MCUs). This makes AERO PRO ideal for demanding applications such as edge AI devices or power management ICs in electronic control units (ECUs).
The AERO PRO processes wire diameters from 0.5 to 2.0 mil (≈ 12.7–50.8 µm) and wire lengths from 0.2 to 8.0 mm – ideal for fine-pitch bonding on high-density substrates up to 105 × 300 mm.
Intelligent automation
The AERO PRO features AI-supported process monitoring. This includes the AERO EYE real-time monitoring system, AERO Diagnostic for analysis and AERO Predictive Maintenance for performance forecasting. Continuous quality control increases yield and operational efficiency. The AERO PRO is fully automatable and can be seamlessly integrated into automated guided vehicles (AGVs), rail-guided systems (RGVs), overhead conveyor systems (OHTs) and manufacturing execution systems (MES).
AERO PRO, the innovative wire bonding solution for high-quality IC contacting, is the star attraction at ASMPT's NEPCON booth in Japan.
Image credit: ASMPT
About ASMPT Limited (“ASMPT”)
ASMPT Limited is a leading global supplier of hardware and software solutions for the manufacture of semiconductors and electronics. Headquartered in Singapore, ASMPT’s offerings encompass the semiconductor assembly & packaging, and SMT (surface mount technology) industries, ranging from wafer deposition to the various solutions that organize, assemble and package delicate electronic components into a vast range of end-user devices, which include electronics, mobile communications, computing, automotive, industrial and LED (displays). ASMPT partners with customers very closely, with continuous investments in R&D helping to provide cost-effective, industry-shaping solutions that achieve higher productivity, greater reliability, and enhanced quality. ASMPT is a founding member of the Semiconductor Climate Consortium.
To learn more about ASMPT, please visit www.asmpt.com.
About ASMPT Semiconductor Solutions (“ASMPT SEMI”)
ASMPT SEMI is the leading supplier in advanced packaging and semiconductor assembly solutions. With a commitment to innovation and customer satisfaction, ASMPT SEMI provides a comprehensive range of products and services that cater to the evolving needs of the microelectronics industry. Their expertise spans across areas such as flip-chip and wafer-level packaging, advanced interconnect technologies, and more. ASMPT SEMI's cutting-edge solutions enable customers to achieve higher performance, increased reliability, and improved cost-efficiency when producing their semiconductor devices.
ASMPT SEMI sees itself as a pioneer and driving force of the Intelligence Revolution. With its advanced packaging and assembly technologies, the business segment creates the invisible connections that enable intelligent applications in Artificial Intelligence, Smart Mobility and Hyperconnectivity.
For more information about ASMPT SEMI, visit semi.asmpt.com.
Media contacts: ASMPT Strategic Marketing Team (SEMI Solutions)
Global ASMPT Semiconductor Solutions Press Office ASMPT Limited Hong Kong Jessica Ho Semiconductor Solutions E-Mail: semi_stratmkt@asmpt.com Website: semi.asmpt.com
Global ASMPT Press Office& Susanne Oswald Rupert-Mayer-Strasse 48 81379 Munich Germany Phone: +49 89 20800-26439 E-Mail: susanne.oswald@asmpt.com Website: asmpt.com
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