10.01.2025
Singapore, January 10, 2025 – ASMPT will present at NEPCON Japan, January 22-24, 2025, at Tokyo Big Sight, Booth E66-28. The debut of a high-precision multi-chip bonder, MEGA, will mark its first appearance, presenting solutions tailored for communication in AI devices.
"The AI (Artificial Intelligence) market is currently experiencing significant growth, poised to drive substantial technological advancements in the years ahead, particularly reshaping semiconductor manufacturing across various sectors such as high-performance computing, electric vehicle manufacturing, and consumer electronics," stated Tatsuya Kawamura, Japan Country Manager at ASMPT. He emphasized that ASMPT is well-positioned to lead in this new AI era as a premier provider of semiconductor packaging equipment.
High-speed data exchange and powerful computing capabilities are crucial in AI applications. Optical communication, known for its rapid speeds, wide bandwidth, enhanced security features, and minimal signal interference, it plays a pivotal role in advancing AI computing, with optical transceivers serving as crucial components that facilitate swift data transmission.
Making its first debut at NEPCON Japan is the ASMPT MEGA series, showcasing precise bonding technology with an exceptional accuracy of ±2μm and achieving bond line thickness (BLT) control at ±5μm, along with UPH up to 12K. The MEGA series emerges as the top-tier solution for optoelectronic chips like photonics and RF components, meeting communication needs in upcoming server clusters and AI-edge devices, marking the onset of a new era of AI-driven innovation.
"With advancements in data transfer and processing, AI applications can extend to benefit various other industries. Alongside showcasing our multi-chip bonder MEGA, we are also presenting our extensive range of solutions tailored for diverse high-end applications such as Smart Automotive and Intelligent Factory, all under one roof at NEPCON JAPAN," highlighted Tatsuya Kawamura.
Visitors to the ASMPT booth at E66-28 will have the opportunity to explore a diverse lineup of solutions, including ASMPT’s latest wire bonding solution, advanced packaging solutions, power module packaging solutions, camera assembly solutions, and SMT solutions.
About NEPCON JAPAN 2025, please visit the official website.
MEGA – Revolutionizing multi-chip packaging with precision and efficiency. Source: ASMPT
About ASMPT Limited (“ASMPT”)
ASMPT Limited is a leading global supplier of hardware and software solutions for the manufacture of semiconductors and electronics. Headquartered in Singapore, ASMPT’s offerings encompass the semiconductor assembly & packaging, and SMT (surface mount technology) industries, ranging from wafer deposition to the various solutions that organise, assemble and package delicate electronic components into a vast range of end-user devices, which include electronics, mobile communications, computing, automotive, industrial and LED (displays). ASMPT partners with customers very closely, with continuous investment in R&D helping to provide cost-effective, industry-shaping solutions that achieve higher productivity, greater reliability, and enhanced quality. ASMPT is also a founding member of the Semiconductor Climate Consortium.
ASMPT is listed on the Stock Exchange of Hong Kong (HKEX stock code: 0522), and is one of the constituent stocks of the Hang Seng TECH Index, Hang Seng Composite MidCap Index under the Hang Seng Composite Size Indexes, the Hang Seng Composite Information Technology Industry Index under the Hang Seng Composite Industry Indexes, the Hang Seng Corporate Sustainability Benchmark Index, and the Hang Seng HK 35 Index.
To learn more about ASMPT, please visit us at asmpt.com.
About ASMPT Semiconductor Solutions (“ASMPT SEMI”)
ASMPT SEMI is the leading supplier in advanced packaging and semiconductor assembly solutions. With a commitment to innovation and customer satisfaction, ASMPT SEMI provides a comprehensive range of products and services that cater to the evolving needs of the microelectronics industry. Their expertise spans across areas such as flip-chip and wafer-level packaging, advanced interconnect technologies, and more. ASMPT SEMI's cutting-edge solutions enable customers to achieve higher performance, increased reliability, and improved cost-efficiency when producing their semiconductor devices.
For more information about ASMPT SEMI, visit semi.asmpt.com.
Media contacts:
Global ASMPT Semiconductor Solutions Press Office ASMPT Limited Jessica Ho Semiconductor Solutions E-mail: ul.ho@asmpt.com Website: semi.asmpt.com
Global ASMPT Press Office ASMPT Ltd. Susanne Oswald Rupert-Mayer-Strasse 48 81379 Munich Germany Tel: +49 89 20800-26439 E-Mail: susanne.oswald@asmpt.com Website: asmpt.com
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