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Enabling HBM 16H Stacks with ASMPT Fluxless AOR: Residue-free Fluxless Bonding Ready for Prime Time

17.12.2024

Using a plasma-based approach, active oxide removal technology empowers 3D chiplet integration and the HBM devices with fine bump pitch roadmaps and new package architectures. Residue-free fluxess bonding is ready for prime time.

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